IP Engineering DirectorID:58600
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan Baru约17小时 ago概述
薪资
25,000 MYR ~ 40,000 MYR
产业类别
Software/Information Processing, IT/Telecommunications, Manufacturing(Computer/Telecommunication), Manufacturing(Electronics/Semiconductors)
工作内容
Highly skilled and visionary IP Engineering Director, to lead the development and delivery of reusable semiconductor IP that powers advanced SoCs, chiplets, and multi-die solutions. This role requires deep expertise in semiconductor IP design, verification, and integration, combined with proven leadership in building and managing engineering teams. While the position is primarily focused on hardware IP development (digital, analog, or mixed-signal), software development experience—such as firmware, device drivers, or modeling frameworks—is a strong plus, enabling HW/SW co-design, system-level optimization, and accelerated customer adoption. The IP Engineering Director will define technical roadmaps, oversee execution, and collaborate with cross-functional teams to deliver silicon-proven IP solutions that meet aggressive power, performance, and area (PPA) targets.
Key Responsibilities
1. Leadership & Strategy
• Define and execute the company’s IP engineering roadmap aligned with product strategy.
• Build and lead a world-class IP engineering team across design, verification, validation, and integration.
• Mentor and develop engineering leaders, fostering innovation, collaboration, and technical excellence.
• Drive continuous improvement in design methodology, automation, and productivity.
2. IP Development & Execution
• Lead architecture, micro-architecture, and RTL design of reusable IP (e.g., memory interfaces, high-speed I/Os, interconnects, SerDes, or accelerators).
• Oversee verification, validation, and sign-off, ensuring robust, silicon-proven IP delivery.
• Collaborate with SoC, package, and system teams for seamless integration into chiplet and multi-die systems.
• Support post-silicon debug, bring-up, and customer deployment of IP blocks.
3. Cross-Functional Collaboration
• Partner with software teams on firmware, drivers, and simulation frameworks to ensure full-stack enablement.
• Engage with product, SoC, and system architects to align IP functionality with end-market requirements.
• Collaborate with foundries, EDA vendors, and ecosystem partners to enhance IP design flows and deployment.
4. Program Management & Delivery
• Own IP program planning, milestones, schedules, and risk management.
• Ensure timely delivery of high-quality IP to internal design teams and external customers.
• Drive design reuse and scalability across multiple projects and product lines.
5. Execution & Delivery
• Own NoC project planning, execution, and delivery, ensuring schedule adherence and quality.
• Establish and improve design methodologies, verification flows, and automation for rapid, reliable development.
• Support bring-up, debug, and performance validation in both pre-silicon and post-silicon environments.
资格
应征条件
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field; PhD is a plus.
• 15+ years in semiconductor design, with 5+ years in a senior leadership or director-level role.
• Proven record of delivering silicon-proven IP in SoCs or ASICs.
• Strong technical background in digital design (RTL, synthesis, STA), mixed-signal design, or high-speed interfaces.
• Knowledge of verification methodologies, DFx, and post-silicon validation.
• Familiarity with advanced packaging (2.5D/3D IC, chiplets, interposers) is a strong plus.
• HW/SW development experience (firmware, device drivers, or modeling) is highly desirable.
• Excellent leadership, communication, and problem-solving skills.
• Customer-facing and cross-functional collaboration experience.英文
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其他语言
English
附加信息
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment工作时间
8am ~ 5pm
假日
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职业类别
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