5个职位: 招聘信息 董事
Director of Advanced Package & Board TeamID:59117
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan Baru工作内容
The Director of Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.Key Responsibilities1. Leadership & Strategy• Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.• Define and execute packaging and board technology strategy aligned with company silicon product roadmap.• Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).• Drive innovation in thermal management, signal integrity, and power delivery optimization.2. Technical Execution• Oversee design and validation of interposers, substrates, and system boards from concept to production release.• Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.• Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.• Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.• Manage board-level design for system bring-up, test platforms, and reference designs.3. Supplier & Ecosystem Management• Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.• Partner with EDA vendors to establish design automation flow and DRC verification.• Drive technology transfer and pilot runs with manufacturing partners.4. Project & People Management• Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.• Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.• Foster collaboration across silicon, test, reliability, and operations teams.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment[Japanese Speaker]General ManagerID:57904
10,000 MYR ~ 15,000 MYRKota Damansara/Petaling Jaya工作内容
We are looking for a candidate who can lead our content creator and video production team, and take full responsibility for overall organizational management.Key Responsibilities:-Support HR tasks: recruitment coordination, onboarding/offboarding, attendance tracking-Handle basic accounting: invoice processing, payment tracking, bookkeeping-General admin: office supply management, document filing, scheduling, visitor support-Report to Director[Japan]
福利制度
Salary:RM10,000~15,000RM
Fixed transportation allowance: RM300
Annual Leave (AL): 10days
Medical Leave (MC): 14 days
Bonus: Equivalent to 1 month’s salary
Medical allowance: RM1,000–1,500 per year
Insurance: Includes business trips to Japan for training 1–2 times a year (approximately 1 week per trip)IP Engineering DirectorID:58600
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan Baru工作内容
Highly skilled and visionary IP Engineering Director, to lead the development and delivery of reusable semiconductor IP that powers advanced SoCs, chiplets, and multi-die solutions. This role requires deep expertise in semiconductor IP design, verification, and integration, combined with proven leadership in building and managing engineering teams. While the position is primarily focused on hardware IP development (digital, analog, or mixed-signal), software development experience—such as firmware, device drivers, or modeling frameworks—is a strong plus, enabling HW/SW co-design, system-level optimization, and accelerated customer adoption. The IP Engineering Director will define technical roadmaps, oversee execution, and collaborate with cross-functional teams to deliver silicon-proven IP solutions that meet aggressive power, performance, and area (PPA) targets.Key Responsibilities1. Leadership & Strategy• Define and execute the company’s IP engineering roadmap aligned with product strategy.• Build and lead a world-class IP engineering team across design, verification, validation, and integration.• Mentor and develop engineering leaders, fostering innovation, collaboration, and technical excellence.• Drive continuous improvement in design methodology, automation, and productivity.2. IP Development & Execution• Lead architecture, micro-architecture, and RTL design of reusable IP (e.g., memory interfaces, high-speed I/Os, interconnects, SerDes, or accelerators).• Oversee verification, validation, and sign-off, ensuring robust, silicon-proven IP delivery.• Collaborate with SoC, package, and system teams for seamless integration into chiplet and multi-die systems.• Support post-silicon debug, bring-up, and customer deployment of IP blocks.3. Cross-Functional Collaboration• Partner with software teams on firmware, drivers, and simulation frameworks to ensure full-stack enablement.• Engage with product, SoC, and system architects to align IP functionality with end-market requirements.• Collaborate with foundries, EDA vendors, and ecosystem partners to enhance IP design flows and deployment.4. Program Management & Delivery• Own IP program planning, milestones, schedules, and risk management.• Ensure timely delivery of high-quality IP to internal design teams and external customers.• Drive design reuse and scalability across multiple projects and product lines.5. Execution & Delivery• Own NoC project planning, execution, and delivery, ensuring schedule adherence and quality.• Establish and improve design methodologies, verification flows, and automation for rapid, reliable development.• Support bring-up, debug, and performance validation in both pre-silicon and post-silicon environments.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementNetwork-on-Chip (NoC) Team Engineering DirectorID:58599
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan Baru工作内容
This role will lead the architecture, design, and development of high-performance interconnect solutions for SoCs, chiplets, and advanced packaging systems. The ideal candidate will have deep expertise in NoC architecture, RTL/micro-architecture design, performance modeling, and verification, combined with strong leadership skills. Experience in both hardware and software development is a strong plus, as it enables system-level optimization, modeling, and seamless HW/SW co-design for next-generation NoC solutions. The NoC Team Director will drive technical strategy, manage execution, mentor a multidisciplinary team, and collaborate with cross-functional partners to deliver state-of-the-art interconnect IP for data-intensive and AI-driven applications. Key Responsibilities1. Leadership & Strategy• Define and execute the company’s NoC technology roadmap, aligned with product and system- level requirements.• Build, mentor, and lead a high-performing team of architects, designers, verification engineers, and performance modelers.• Foster innovation in NoC design, methodology, and automation to achieve best-in-class power, performance, and area (PPA).2. NoC Architecture & Design• Lead the design of scalable, configurable, and high-bandwidth NoC architectures for heterogeneous SoCs and multi-die systems.• Drive micro-architecture, RTL design, and integration of NoC subsystems, including coherency, QoS, and security features.• Oversee performance modeling, traffic analysis, and system-level simulation to ensure NoC meets latency and bandwidth requirements.• Collaborate with physical design teams to optimize NoC topology, floorplanning, and timing closure. 3. Cross-Functional Collaboration• Partner with CPU/GPU/AI accelerator, memory subsystem, and IP teams to define NoC interfaces and integration requirements.• Collaborate with software teams on NoC modeling frameworks, traffic generators, drivers, and firmware for validation and optimization.• Engage with product and system architects to align NoC capabilities with end-market requirements (AI/ML, datacenter, automotive, mobile).4. Execution & Delivery• Own NoC project planning, execution, and delivery, ensuring schedule adherence and quality.• Establish and improve design methodologies, verification flows, and automation for rapid, reliable development.• Support bring-up, debug, and performance validation in both pre-silicon and post-silicon environments.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementF&B Director ID:58589
15,000 MYR ~ 18,000 MYRKota Damansara/Petaling Jaya工作内容
1. Oversee daily operations of all F&B outlets, including restaurants, lounges, banquets, and in-room dining.2. Develop and implement strategic plans to improve service quality, operational efficiency, and financial performance.3. Collaborate with Executive Chef and culinary teams on menu development, food presentation, and cost control.4. Monitor guest satisfaction and respond to feedback to continuously improve service delivery.5. Ensure compliance with health, safety, and hygiene standards across all F&B areas.6. Lead recruitment, training, and development of F&B staff to maintain high performance and morale.7. Manage budgets, forecasts, and financial reports; analyze sales and profitability metrics.8. Coordinate with Sales and Events teams to support catering and banquet operations.9. Drive innovation in F&B offerings to enhance guest experience and stay competitive.10. Maintain vendor relationships and oversee procurement of food, beverages, and supplies.
福利制度
Will be disclosed during interview
