5个职位: 招聘信息 研发(工程师(IT/互联网/电信))
Technical Product Manager (Sales / E-commerce)ID:60564
15,000 MYR ~ 20,000 MYRShah Alam工作内容
＜Summary＞Lead the development of customer-facing features that improve sales performance, customer retention, and personalization for SECAI MARCHE's B2B E-commerce platform. This hybrid role combines Product Management with hands-on software engineering to deliver measurable business impact.＜Job Responsibilities＞・Lead the planning, development, and implementation of recommendation and personalization features for the B2B E-commerce platform.・Develop automated upselling and cross-selling capabilities to improve customer lifetime value.・Build customer retention features and improve CRM data quality.・Analyze customer behavior, purchasing trends, and product performance using SQL.・Collaborate closely with Sales and Customer Success teams to transform business needs into product features.・Improve HubSpot CRM functionality and customer data structure.・Measure feature performance and continuously optimize business outcomes.・Participate in full-stack development using modern cloud technologies and AI-assisted development tools.
福利制度
-Medical benefits (inpatient & outpatient)
-Flextime system
-Staff discount for farm direct produces
- EPF, SOCSO provided
- AL : 14days,
MC : 14 days
- Maternity & paternity leavesTechnical Product Manager（Supply Chain）ID:60565
15,000 MYR ~ 20,000 MYRShah Alam工作内容
＜Summary＞Lead the digital transformation of this company's supply chain operations by building data-driven systems for procurement, inventory, and demand forecasting. This hybrid role combines Product Management with software engineering to improve operational efficiency and profitability.＜Job Responsibilities＞・Analyze and optimize procurement workflows by identifying bottlenecks and automation opportunities.・Develop systems that automate purchasing, inventory control, and demand forecasting.・Improve SKU-level margin visibility and inventory management.・Design dashboards and reporting tools for supply chain operations.・Collaborate with Sales, Operations, and Customer Success teams to improve business profitability.・Build data structures supporting forecasting, waste reduction, and operational planning.・Continuously improve operational efficiency through product enhancements and automation.I-assisted development tools.
福利制度
-Medical benefits (inpatient & outpatient)
-Flextime system
-Staff discount for farm direct produces
- EPF, SOCSO provided
- AL : 14days,
MC : 14 days
- Maternity & paternity leavesAdvanced Package & Board Team (Senior/Staff/Principal)ID:59718
10,000 MYR ~ 30,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
The Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.Key Responsibilities1. Leadership & Strategy• Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.• Define and execute packaging and board technology strategy aligned with company silicon product roadmap.• Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).• Drive innovation in thermal management, signal integrity, and power delivery optimization.2. Technical Execution• Oversee design and validation of interposers, substrates, and system boards from concept to production release.• Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.• Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.• Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.• Manage board-level design for system bring-up, test platforms, and reference designs.3. Supplier & Ecosystem Management• Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.• Partner with EDA vendors to establish design automation flow and DRC verification.• Drive technology transfer and pilot runs with manufacturing partners.4. Project & People Management• Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.• Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.• Foster collaboration across silicon, test, reliability, and operations teams.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSenior Standard Cell Design EngineerID:59656
10,000 MYR ~ 22,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking a Library Design Engineer to own the end-to-end development of a production-grade standard cell library on leading-edge process nodes. You will drive transistor-level design, multi-Vt cell topology, full characterization, and PPA validation delivering robust, sign-off-ready library views to downstream implementation flows. Seniority level to be determined by experience.Key Responsibilities• Design, simulate, and analyze standard cell circuits at transistor level, including combinational, sequential, clock, and physical utility cells across multiple Vt flavors (HVT/SVT/LVT/ULVT) and drive strengths.• Perform layout process-node-shift; guide layout clean-up effort and review for DRC/LVS compliance, EM/IR rules, and parasitic awareness at the cell level.• Define & execute characterization flow to generate complete library views & models, covering timing (NLDM/CCS/ECSM), power (dynamic, leakage, internal), noise, and variation-aware models (LVF/SOCV/POCV); ensure Liberty, LEF, and GDS consistency.• Define & execute QA regression to check library quality; validate cell robustness including noise margin, drive strength, X-propagation, and scan/DFT cell correctness; drive STA correlation using PrimeTime or Tempus to confirm model accuracy in real PD flows.• Lead standard cell library IP integration into Testchip, including Testchip circuit and test plan development; support hardware bring-up and debug.• Perform pre/post-silicon correlation & model/design optimization; drive root-cause analysis for first-silicon issues and implement yield/robustness improvements.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementIP Engineering DirectorID:58600
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan Baru工作内容
Highly skilled and visionary IP Engineering Director, to lead the development and delivery of reusable semiconductor IP that powers advanced SoCs, chiplets, and multi-die solutions. This role requires deep expertise in semiconductor IP design, verification, and integration, combined with proven leadership in building and managing engineering teams. While the position is primarily focused on hardware IP development (digital, analog, or mixed-signal), software development experience—such as firmware, device drivers, or modeling frameworks—is a strong plus, enabling HW/SW co-design, system-level optimization, and accelerated customer adoption. The IP Engineering Director will define technical roadmaps, oversee execution, and collaborate with cross-functional teams to deliver silicon-proven IP solutions that meet aggressive power, performance, and area (PPA) targets.Key Responsibilities1. Leadership & Strategy• Define and execute the company’s IP engineering roadmap aligned with product strategy.• Build and lead a world-class IP engineering team across design, verification, validation, and integration.• Mentor and develop engineering leaders, fostering innovation, collaboration, and technical excellence.• Drive continuous improvement in design methodology, automation, and productivity.2. IP Development & Execution• Lead architecture, micro-architecture, and RTL design of reusable IP (e.g., memory interfaces, high-speed I/Os, interconnects, SerDes, or accelerators).• Oversee verification, validation, and sign-off, ensuring robust, silicon-proven IP delivery.• Collaborate with SoC, package, and system teams for seamless integration into chiplet and multi-die systems.• Support post-silicon debug, bring-up, and customer deployment of IP blocks.3. Cross-Functional Collaboration• Partner with software teams on firmware, drivers, and simulation frameworks to ensure full-stack enablement.• Engage with product, SoC, and system architects to align IP functionality with end-market requirements.• Collaborate with foundries, EDA vendors, and ecosystem partners to enhance IP design flows and deployment.4. Program Management & Delivery• Own IP program planning, milestones, schedules, and risk management.• Ensure timely delivery of high-quality IP to internal design teams and external customers.• Drive design reuse and scalability across multiple projects and product lines.5. Execution & Delivery• Own NoC project planning, execution, and delivery, ensuring schedule adherence and quality.• Establish and improve design methodologies, verification flows, and automation for rapid, reliable development.• Support bring-up, debug, and performance validation in both pre-silicon and post-silicon environments.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment