Overview
Salary
10,000 MYR ~ 20,000 MYR
Industry
Manufacturing(Electronics/Semiconductors)
Job Description
- Develop, manage, and strengthen long-term relationships with existing customers to ensure high levels of customer satisfaction and retention.
- Serve as the primary escalation point for customers regarding order fulfilment, delivery performance, quality issues, and commercial matters, ensuring timely resolution.
- Drive revenue growth and profitability by expanding business within assigned accounts through cross-selling, upselling, and strategic account penetration.
- Identify, pursue, and secure new product design-in opportunities, particularly in IC packaging and thermal management solutions.
- Develop and manage sales forecasts, budgets, and performance targets, ensuring alignment with company objectives.
- Lead account planning activities, including demand forecasting, pricing strategy, and margin management.
- Coordinate closely with Operations, RnD, Engineering, Quality, and Supply Chain teams to support customer requirements and continuous improvement initiatives.
- Gather and analyse market intelligence, including industry trends, competitive landscape, and emerging technologies particularly in IC packaging heat dissipation solutions.
- Participate in management discussions and strategic planning sessions to align sales strategies with company direction and evolving market demands.
Qualifications
Requirement
- Bachelor’s Degree in Electrical / Electronics Engineering, Materials Science, or related technical discipline.
- Minimum 5–8 years of sales experience in electronic components, semiconductor packaging, or thermal management solutions.
- Proven track record in account management and revenue growth.
- Strong understanding of semiconductor supply chain and design-in sales cycles.
- Excellent negotiation, communication, and presentation skills.
- Ability to work cross-functionally and manage customer escalations effectively.
- Strong analytical and forecasting skills.
Preferred Competencies
- Experience in IC packaging materials (e.g., TIM, heat spreaders, substrates, or related components).
- Established network within OSATs, or semiconductor design houses.
- Familiarity with ASEAN electronics market dynamics.English Level
-
Other Language
Mandarin, English
Additional Information
Benefit
- Annual Leave: 14 days
- Medical Leave: 14 days
- Medical Claims
- Meal Allowance RM100
- Transport Allowance RM150
- Performance BonusWorking Hour
8am ~ 5pm
Holiday
-
Job Function
Please sign in.