Custom Layout Designer/LeadID:60083

8,000 MYR ~ 16,000 MYRBayan Lepasabout 8 hours ago

Overview

  • Salary

    8,000 MYR ~ 16,000 MYR

  • Industry

    Software/Information Processing, IT/Telecommunications, Manufacturing(Computer/Telecommunication), Manufacturing(Electronics/Semiconductors)

  • Job Description

    We are seeking an Custom Layout Designer to execute full-custom physical layout of high-performance
    analog/mixed-signal IPs, working from schematic through to tape-out-ready implementation independently and
    with limited guidance. Seniority level to be determined by experience.

    Key Responsibilities
    • Execute full-custom transistor-level layout of analog/mixed-signal IP blocks (bandgap, LDO, PLL, oscillators, I/O, eFUSE, and other Foundation IP blocks) from schematic to tape-out, independently and with limited guidance.
    • Perform cell-level and block-level floorplanning: power/ground planning, device placement, and routing channel allocation with awareness of signal integrity and parasitic impact on circuit performance.
    • Apply custom layout best practices: device matching (common-centroid, interdigitation), shielding, guard rings, well taps, and substrate isolation to meet noise, mismatch, latch-up, and reliability requirements.
    • Run and resolve DRC, LVS, and ERC sign-off using Calibre or equivalent; ensure clean tape-out verification across all required foundry rule decks.
    • Support or drive parasitic extraction (Calibre xRC or Quantus QRC) and collaborate with the circuit designer to close performance gaps identified in post-layout simulation.
    • Participate in layout reviews with circuit designers: interpret schematic annotations, critical net callouts, and back-annotate layout-sensitive constraints (e.g., symmetry requirements, shielding needs, critical parasitics).
    • Manage layout deliverables for assigned IP blocks: track task progress, provide reliable schedule estimates, and flag risks to the design lead proactively.
    • Maintain organized GDS/OA databases; adhere to layer naming conventions and ensure version-controlled handoff of layout data aligned with IP library delivery standards.
    • Collaborate with the physical verification team on foundry rule deck updates and process-node-related DRC changes; support layout porting across technology nodes as required.
    • Meet EM/IR, electrostatic discharge (ESD), and reliability layout rules; adhere to design methodology guidelines and sign-off checklists established for the IP library.
    • Support testchip integration: contribute layout views for pad ring assembly, coordinate top-level integration with the responsible designer, and assist in post-silicon debug where layout artifacts are suspected.

Qualifications

  • Requirement

    • BS/MS in Electrical/Electronics Engineering, Microelectronics, or related field.
    • Typically 3–5 years of hands-on full-custom analog/mixed-signal IC layout experience, with at least one production tape-out.
    • Proficiency with schematic-driven layout entry, cellview management and advanced routing; working knowledge of Calibre DRC/LVS/ERC or Pegasus equivalent.
    • Solid understanding of custom layout techniques: device matching, common-centroid placement, shielding, guard rings, latch-up prevention, and EM/IR layout rules.
    • Familiarity with parasitic extraction flows and ability to interpret post-extraction netlists in the context of circuit performance specifications provided by the design engineer.
    • Ability to read and interpret transistor-level schematics; communicate layout constraints and tradeoffs clearly with circuit designers and integrate their feedback efficiently.
    • Organized, detail-oriented, and self-directed; able to manage multiple concurrent layout tasks with clear schedule accountability and limited supervision.

    Preferred / Nice-to-Have Experience
    • Layout automation or scripting experience (SKILL, TCL, Python, or Virtuoso PCELL/parameterized cell authoring) for repetitive layout pattern generation or DRC-clean template flows.
    • Exposure to FinFET (7/5/3nm) or GAA process node layout constraints: fin quantization, gate-cut rules, single-diffusion break (SDB/DDB), and advanced metal routing restrictions.
    • Familiarity with post-layout simulation interpretation (HSPICE or Spectre) and understanding of basic analog performance metrics (offset, PSRR, phase noise, jitter) sufficient to triage parasitic impact.
    • ESD layout co-design experience: protection device placement, pad ring assembly, IO buffer layout, and ESD bus routing in the context of a Foundation IP library.
    • Experience with multi-project wafer (MPW) or production testchip tape-out including top-level GDS assembly, fill insertion, and final sign-off coordination with the foundry.

  • English Level

    -

  • Other Language

    English

Additional Information