概述
薪资
10,000 MYR ~ 40,000 MYR
产业类别
Software/Information Processing, IT/Telecommunications, Manufacturing(Computer/Telecommunication), Manufacturing(Electronics/Semiconductors)
工作内容
• Lead the end-to-end development of complex multilayer system boards, including architecture definition, schematic design & technical decision-making.
• Drive component selection, trade-off analysis & architecture optimization to meet electrical, thermal, and mechanical constraints.
• Ensure high-speed signal integrity, power integrity & EMI/EMC compliance through simulation, design & testing.
• Lead board bring-up, root cause analysis, and system-level debug using lab instruments (oscilloscopes, logic analyzers, spectrum analyzers, etc.).
• Define test strategies and validate hardware against functional, environmental, and reliability requirements.
• Prepare and review detailed design documentation: schematics, BOMs, layout constraints, test reports, and manufacturing files.
• Collaborate with PCB layout engineers on components placements, routing and PCB stack up.
• Skilful on handing rework tool to preforming board rework and modifications to hardware components.
• Collaborate with cross-functional teams including SoC, firmware, packaging, mechanical, and manufacturing teams.
• Interface with suppliers, PCB fabrication and assembly vendors for prototyping and production.
• Provide technical leadership, mentoring, and code/design reviews for junior team members.
资格
应征条件
• Bachelor's or Master’s degree in Electrical or Electronics Engineering.
• At least 8 years of hands-on experience in high-complexity PCB/system board design.
• Proficiency in schematic capture and layout tools (e.g., Cadence Allegro, Altium, OrCAD).
• Deep expertise in high-speed digital design (DDR, PCIe, USB, Ethernet, etc.).
• Strong understanding of signal and power integrity, simulation techniques, and SI/PI tools (e.g., HyperLynx, Sigrity).
• Demonstrated experience with board bring-up, lab validation, and production ramp.
• In-depth knowledge of DFM/DFT, EMC/EMI, and regulatory compliance requirements.
• Excellent problem-solving and analytical skills in solving complex system issues independently.
• Highly self-motivated, meticulous, independent with strong ownership on critical deliverables.
• Strong interpersonal skills and collaborative across teams.
• Preferred Qualifications:
1. Experience with designs involving FPGAs, SoCs, PMICs, custom ASICs, or AI/ML accelerators.
2. Familiarity with thermal design, power supply design, and mechanical constraints.
3. Experience in industrial, networking, datacenter, automotive, or medical hardware development environments.
4. Knowledge of embedded firmware or system software.
5. Prior experience with project or technical leadership roles.英文
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其他语言
English
附加信息
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment工作时间
8am ~ 5pm
假日
Follow Malaysia PH
职业类别
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