Overview

• Salary

  3,000 MYR ~ 4,500 MYR

• Industry

  Manufacturing(Electronics/Semiconductors)

• Job Description

  Process development
  - Driving end-to-end process development and continuous improvement across internal teams
  - Support customer process development and optimize application performance
  
  Test Cut
  - Conduct in-house application test cuts to obtain best combination of dicing blades and parameters
  - Provide on-site customer technical support to resolve customer issues (e.g. Quality, MTBA and etc)
  
  Affiliate offices coordination / communication
  - Communicate regularly with engineering teams across regions to coordinate technical alignment and solutions
  
  Customer Relations
  - Establish and maintain strong customer relationships to ensure satisfaction and increase reputation
  - Advanced technologies
  - Responsible to keep up-to-date on latest technologies for dicing, grinding, and polishing
  - Understand and utilize to meet customers’ need