概述

• 薪资

  3,860 MYR ~ 4,850 MYR

• 工作行业

  Manufacturing(Electronics/Semiconductors)

• 工作内容

  Responsibilities
  - Responsible for planning and managing project timeline.
  - To develop and design project process flow.
  - Provides overall coordination of tool transfer from internal / external.
  - Provide costing and quotation to customer (RFQ).
  - Responsible for Bom and Route setup.
  - To provide technical feedback and review FA result with the team, provide correction / improvement plans to follow up.
  - To track and update the progress of cost down project in the system.
  - To handle other tasks and duties as and when requested by superior.
  
  Authorities
  - AX access on general engineering for BOM / Route setup and general inquiry.
  - To access engineering / stamping / molding and plating folder relating to costing and rates per piece.
  - EPR / Intralink / email access.
  - Latest prints distribution to document control.
  - Door access for stamping / molding building and plating building.