Overview

• Salary

  13,000 MYR ~ 15,000 MYR

• Industry

  -

• Job Description

  Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
  
  【Key Responsibilities】
  - Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
  - Ramp up manufacturing volume and qualify required sources.
  - Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
  - Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
  - Manage Product Lifecycle Management documents to the latest status.
  - Conduct change-management with suppliers to sustain / improve capacity and cost.
  - Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
  - Serve as the key manufacturing engineering interface for NPI-to-production transfers
  - Manage OSAT and contract manufacturing relationships supporting production