Staff Process EngineerID:60154

9,983 MYR ~ 14,267 MYRBayan Lepasabout 8 hours ago

Overview

  • Salary

    9,983 MYR ~ 14,267 MYR

  • Industry

    Manufacturing(Electronics/Semiconductors)

  • Job Description

    【Job description】
    Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

    【Key Responsibilities】
    - Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
    - Ramp up manufacturing volume and qualify required sources.
    - Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
    - Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
    - Manage Product Lifecycle Management documents to the latest status.
    - Conduct change-management with suppliers to sustain / improve capacity and cost.

Qualifications

  • Requirement

    【Must】
    - Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
    - Having at least 5 years experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
    - Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
    - Knowledge of SPC and statistical analysis software (such as JMP).

  • English Level

    -

  • Other Language

    English

Additional Information

  • Benefit

    Annual Salary Range :RM119800-RM171200
    (Monthly: RM9,983-RM14,267)

    *Regarding the employee benefits, please check them directly with the company during your interview.

  • Working Hour

    - ~ -

  • Holiday

    Follow Malaysian Calendar

  • Job Function

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