【招聘结束】 Sales Manager ID:59424

该职位的招聘已结束

10,000 MYR ~ 20,000 MYR高渊 Nibong Tebal14日 ago

概述

  • 薪资

    10,000 MYR ~ 20,000 MYR

  • 工作行业

    Manufacturing(Electronics/Semiconductors)

  • 工作内容

    - Develop, manage, and strengthen long-term relationships with existing customers to ensure high levels of customer satisfaction and retention.
    - Serve as the primary escalation point for customers regarding order fulfilment, delivery performance, quality issues, and commercial matters, ensuring timely resolution.
    - Drive revenue growth and profitability by expanding business within assigned accounts through cross-selling, upselling, and strategic account penetration.
    - Identify, pursue, and secure new product design-in opportunities, particularly in IC packaging and thermal management solutions.
    - Develop and manage sales forecasts, budgets, and performance targets, ensuring alignment with company objectives.
    - Lead account planning activities, including demand forecasting, pricing strategy, and margin management.
    - Coordinate closely with Operations, RnD, Engineering, Quality, and Supply Chain teams to support customer requirements and continuous improvement initiatives.
    - Gather and analyse market intelligence, including industry trends, competitive landscape, and emerging technologies particularly in IC packaging heat dissipation solutions.
    - Participate in management discussions and strategic planning sessions to align sales strategies with company direction and evolving market demands.

资格

  • 任职资格

    - Bachelor’s Degree in Electrical / Electronics Engineering, Materials Science, or related technical discipline.
    - Minimum 5–8 years of sales experience in electronic components, semiconductor packaging, or thermal management solutions.
    - Proven track record in account management and revenue growth.
    - Strong understanding of semiconductor supply chain and design-in sales cycles.
    - Excellent negotiation, communication, and presentation skills.
    - Ability to work cross-functionally and manage customer escalations effectively.
    - Strong analytical and forecasting skills.

    Preferred Competencies
    - Experience in IC packaging materials (e.g., TIM, heat spreaders, substrates, or related components).
    - Established network within OSATs, or semiconductor design houses.
    - Familiarity with ASEAN electronics market dynamics.

  • 英文

    -

  • 其他语言

    Mandarin, English

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