概述

• 薪资

  6,000 MYR ~ 8,000 MYR

• 产业类别

  Manufacturing(Electronics/Semiconductors)

• 工作内容

  【Job Responsibilities】
  • Participate in sub-blocks and module-blocks floor planning and routing from scratch.
  • Perform layout blocks verification with sign-off in area (such as DRC, LVS, ANT, ERC & PERC) and troubleshooting the results.
  • Good hands-on experience in analog layout device matching techniques, high speed shielding and validation, as well to have acquired broader knowledge in handling high voltage devices.
  • Co-work with architect, design lead, designers, layout lead and layout engineers to achieve modules/full chip integration, place and route, chip level verification and tape-out.
  • Responsible for layout optimization, post layout extraction and parasitic analysis by ensuring analog and mixed signals circuits meet chip level tape-out, sign-off at desired area, performance, and power.
  • Specific technical expertise is desired in a broad range of process technologies from Bipolar, CMOS, DMOS (BCD) to FinFET advance node in complex, high-performance analog and mixed signals circuits layout.
  • Proactively look for continuous improvement opportunities in the complete layout flow methodologies (flow, layout, and design) as well as develop accurate IC layout design schedules and resource estimates.