Field service engineer (Semiconductor dev)ID:55498

5,000 MYR ~ 8,000 MYRBayan Lepasabout 12 hours ago

Overview

  • Salary

    5,000 MYR ~ 8,000 MYR

  • Industry

    Trading Firm

  • Job Description

    -Responsible for Service support equipment in semiconductor backend market
    -Product: Wire bonder, Die bonder which is for semiconductor
    *Installation/Modification/troubleshooting/parts replacement/provide trainings
    *Basically, work at customer site

    Details
    - Undertake full commission activities including installation, setup, configuration, software deployment, testing, customer commissioning, on site Buyoff until completion of Site Acceptance by customer
    - Close communication with customer, identify customer’s needs and initiate sales opportunities to increase service revenue.
    - Reporting all service activities in approved Service Management Systems and meet key performance indicators
    - Perform corrective maintenance on machines belong to customers; Perform preventive maintenance on schedule.
    - Perform service and recondition faulty equipment after repair; Perform pre-installation test, installation and commissioning of machines at customers’ sites.
    - Provide timely and proper report to customers after completion of a service call; Execute task assigned within response time; Check, track and monitor unclosed call till completion.
    - Provide professional and excellent service to customers and at times to fellow engineers when required; Maintain cordial relationships with customers, peer,s and fellow staff.
    - Facilitate Call Desk with a complete update after completing a service call on a timely manner; Ensure spare parts requested are returned promptly within the specified timeframe given.
    - Completion of manual FE report and return to Call Desk within 2 days.
    - Report to Technical Manager, Sales Manager

    ■Working location: Customer's site.
    - Renesas Electronics
    Bayan Lepas Free Industrial Zone, 11900 Penang, Malaysia
    Google Map:https://goo.gl/maps/E58o6WoreeTMzSdCA

    - Micron Memory Malaysia SDN BHD
    Lebuhraya Bandar Cassia, 14200 Sungai Jawi, Penang
    04-377 0500
    https://goo.gl/maps/r2hJY7JagD8fbk2p7

Qualifications

  • Requirement

    [Must]
    - Over Diploma/Degree
    - 2 years of Engineer or field engineer experience related to Wire bonding or Die bonding
    - Ability to read mechanical drawings
    - Willing to travel and possess own transport (car).

    [Prefer]
    - Having experience die bonder or wire bonder machine

  • English Level

    -

  • Other Language

    English

Additional Information

  • Benefit

    RM5000-8000 depends on the career
    -Car Allowance RM 400 / month,(If the candidate use Train ,train allowance RM 200)
    -Annual leave, Medical leave
    -Medical fee:RM2000/year
    -Local travel mileage :RM0.7/km
    -Business trip allowance RM100/ more than 100 km (one way)
    -Company phone/sim, Laptop will be provided by company.

  • Working Hour

    9:00 ~ 17:30

  • Holiday

    Sat,Sun, National holiday

  • Job Function