111个职位: 招聘信息 工程师(半导体)
Principal Engineer/Principal Architect (Design Verification)ID:59120
20,000 MYR ~ 30,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking an experienced and visionary Principal Engineer/Architect (Design Verification) to lead and drive next-generation design verification strategies, methodologies and execution. The ideal candidate will play a key technical role in shaping SkyeChip's DV architecture, methodologies, and execution frameworks to ensure world-class product quality and verification efficiency.Join us if you are a passionate and forward-thinking verification leader who thrives in a fast-paced, innovation-driven semiconductor environment and enjoys mentoring teams, solving complex verification challenges, and influencing design quality and other global engineering teams.Key Responsibilities1. DV Architecture and Methodology Leadership• Define and drive scalable, reusable, and high-efficiency DV architecture and methodology.• Establish verification best practices, including testbench architecture, constrained-random verification, coverage-driven methodologies, and formal verification integration.• Champion automation, regression management, and coverage closure frameworks for continuous efficiency improvement.2. Technical Strategy and Execution• Define verification strategies and verification plans for complex IP design verification (NOC, memory, etc.).• Evaluate and implement state-of-the-art tools, verification techniques, and verification accelerators.• Drive sign-off criteria definition, including functional and code coverage, assertions, and quality metrics.3. Cross-Functional Team Collaboration• Collaborate closely with architecture, design, software teams to ensure robust verification plans and alignment on design intent.• Provide technical guidance to local and global DV teams to standardize and scale best practices.4. Leadership and Mentoring• Mentor and develop technical talent within the DV team, promoting innovation and continuous learning.• Conduct technical reviews, training, and methodology adoption sessions.• Act as a key technical interface with stakeholders and management on DV efficiency and quality metrics.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementCircuit Design Manager / Senior ManagerID:59119
20,000 MYR ~ 35,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
• Lead and manage team that design and implement high speed interfaces and complex mixed-signal circuits using cutting-edge CMOS tech and EDA tools.• Manage deliveries between function groups for example Layout, RTL , DV , Physical Design and SIPI/Package.• Harmonize schedule and end to end delivery• Work closely with business development team to understand future projects and resource needed• First line of clarification and explanation for customer related questions and support• Work with post silicon team for design intent and required validations
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementPrinciple Digital Design EngineerID:59118
20,000 MYR ~ 25,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
This role will be responsible for architecting, designing, and verifying complex digital IPs and subsystems for SoCs or ASIC/FPGA-based products. As a senior role, it requires to work closely with system architects, verification, and physical design teams to deliver high-performance, power-efficient, and functionally correct RTL implementations. Overall, the responsibilities cover wider scope encompassing from IP to subsystem level and SOC level global issues.Key ResponsibilitiesArchitect with system engineers to perform:-• Define IP specifications, architecture & test concept.• Specify correct implementation of RTL design and verify digital circuits to deliver high performance, low power, and efficient implementation.• Conduct design reviews and support in documentation.• Support verification engineer to define verification test items.• Support in the roadmap formulation for the sensor IPs.• Support view generation engineers to verify the correctness of the Ips views.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementDirector of Advanced Package & Board TeamID:59117
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan Baru工作内容
The Director of Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.Key Responsibilities1. Leadership & Strategy• Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.• Define and execute packaging and board technology strategy aligned with company silicon product roadmap.• Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).• Drive innovation in thermal management, signal integrity, and power delivery optimization.2. Technical Execution• Oversee design and validation of interposers, substrates, and system boards from concept to production release.• Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.• Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.• Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.• Manage board-level design for system bring-up, test platforms, and reference designs.3. Supplier & Ecosystem Management• Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.• Partner with EDA vendors to establish design automation flow and DRC verification.• Drive technology transfer and pilot runs with manufacturing partners.4. Project & People Management• Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.• Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.• Foster collaboration across silicon, test, reliability, and operations teams.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementProject Management Executive (JB)ID:59107
4,000 MYR ~ 7,000 MYRJohor Bahru工作内容
Main Responsibilities:Assist the R&D team in completing project progress tracking and reporting within the projectResponsibilities and Key Work Points1. Write project progress reports, meeting minutes, and make presentations.2. Follow up on project milestones, remind the team of key task deadlines, and assist with cross-departmental collaboration tasks.3. Organize R&D meetings, prepare meeting materials and record resolutions.4. Assist the R&D team in docking with BU/TBU and other departments to convey technical requirements or feedback.5. Translate technical documentation related to research and development, ensure the accuracy of professional terms, proofread translated documents, and ensure language fluency.6.Provide real-time interpretation (Chinese to English,, etc.) for cross-border technical conferences and business negotiations to ensure clear communication without ambiguity.7.Complete temporary work tasks assigned by superiors.
福利制度
- Phone allowance
- OT allowance
- Optical / Dental = RM300
- Medical = RM500
- Annual Leave
- Compassionate Leave
- Marriage Leave
- Travel AllowanceSenior Electrical Project Engineer (Grid Business)ID:59103
6,000 MYR ~ 9,000 MYRBangsar工作内容
【Job Responsibilities】<Technical> • Familiar with high voltage transmission primary equipment, Toshiba standard and international engineering standard (ie. JIS/IEC/ IEEE etc). Ensuring engineering operations and activities comply with laws, regulations, and standards.• Execute awarded scope and manage vendors to deliver the product/ service work as per contract, schedule and quality.• Responsible for the Project Specifications and Schedules.• Liaising with Project Customer and vendors.• Maintains open communication with vendors.• Support drawings review, technical specification submission from vendors.• Maintains project document list.• Support RFQ, RFP, tender and bid for Project.• Participate site/meeting with clients / consultants / contractors to resolve project issues.• Report on issues, successes, and technical needs.• Coordinate and communicate with internal departments effectively to ensure information is aligned.• Perform other duties and tasks as assigned by management from time to time.<Technical Development & Team Contributions> • Learn and apply company standards, relevant codes and company procedures.• Participate in training programs, knowledge sharing, and internal technical reviews.• Collaborate closely with Engineers on assigned scopes.• Record and manage engineering know-how, lessons learned, and technical data in the internal database.• Continuous up to date with technology changes in Toshiba, competitors, market/ solutions in the market, domestic and regional statutory and requirements/ laws.• Able to work effectively in a single contributor role and project team setting given the pressure and complexed business environment.
福利制度
- Annual Leave
- Medical Leave
- Contracture Bonus
- Performance Bonus (subject to personal competency)
- Annual Increment
- Parking & Milage Claim
- Company Insurance
- Travelling Allowance (following company travel policy)Senior Business Leader - Thermal Technology OperationsID:59096
10,000 MYR ~ 30,000 MYRBayan Lepas工作内容
- Establish a complete operational infrastructure for thermal technology products in Asia.- Work closely with the Technical Leader of the Global Thermal Team to create an entity capable of producing all thermal products for worldwide business units.- Develop and implement a reliable supply chain strategy in a low-cost region.- Set up manufacturing facilities focused on electromechanical assembly as the primary internal capability.- Build and manage a cost-effective engineering team (electrical and mechanical) to complement system architects located in the USA, Japan, and Germany.- Drive operational excellence, cost optimization, and scalability to meet global demand.- Ensure compliance with industry standards and quality requirements for semiconductor thermal products.- All other duties and tasks that may be required.
福利制度
- Car Allowance
- Performance Bonus x3/year
- Annual Leave 16 days onwards
- Medical Leave 14 days onwards
- Follow all Public HolidaysSales & Application EngineerID:59085
4,000 MYR ~ 6,000 MYRUSJ/Subang Jaya工作内容
・Development & implementation of the factory automation solution strategies using Industry 4.0 technologies in line with the company’s business vision & goals ・Execution of the sales workflow and to discover the opportunities and markets for IIoT and Industry 4.0 solutions・Coordination of proposal workflow ・Execution of the project workflow (Planning, Scope, Budget, Quality, Documentation)・Present and offer solutions to customers that include: Production Performance & Andon System / Energy Monitoring System / Condition Monitoring System / Track & Trace System / Process Monitoring & Control / Wireless Data Acquisition System. ・Automation software used to offer solutions to customers include PLC / IPC / SCADA / SQL ・Calculate engineering services based on or customer requirements (FDS/TDS)・Coordinate small/midrange projects from specification > engineering > testing > commissioning > support・Train & support application services to customers
福利制度
・Basic Salary = RM 4,000 ~ RM 6,000
・AL: <2Y 12D, <5Y 16D, <10Y 20D, >11Y 22D
・MC: <2Y 14D, 2~5Y 18D, >5Y 22D
・Car Allowance = RM500
・Petrol Fleet Card @ RM420
・Sales Incentive
・Year End Bonus (based on company performance) ** Average 1 monthCustomer Engineer (Selangor) - Grinder ID:59071
3,000 MYR ~ 4,500 MYRKota Damansara/Petaling Jaya工作内容
- As first responder for all machine issues (machine installation, troubleshooting, maintenance)- Conduct machine training (operation, maintenance, basic application) to customer (engineer, technician and operator)- Provide guidance to engineer/operator/technician on how to fully utilize machine and its integrated function, to maximize machine performance capability- Plan, schedule and execute machine improvement activities (MTBA, OEE improvements, error reductions, conduct preventive maintenance)- Act as technical/engineering interface for Sales and Application members
福利制度
- Car Allowance
- Mileage Claim (for other state) : standardized payment
- Health Screening
- DentalMIS ENGINEER (SOFTWARE)ID:59080
3,800 MYR ~ 6,000 MYRShah Alam工作内容
• To develop software applications to specification of superiors and or end users.• To maintain and modify the developed software according to end users’ requirements.• To train end users in the developed software applications.• To maintain and modify external third-party software application to according to specification.• To assist the integration of various software to achieve an integrated Management Information Systems.• To perform any other functional responsibilities or assigned by superior.
福利制度
- Salary: RM3,800~6,000
- 5 days of work
- Annual Leave (14 days)
- Medical Leave (14 days)
- Medical Cover for Family
- Hospitalizations Insurance
- Personal Accident Insurance
- Monthly Performance Incentives
- Free Parking
- Free Uniform
- Subsidize Meal
- Health Care
- Course Subsidies for Self-Developments
- Retirement Benefits
- Training & Developments
- Dental Care
- Plus other Benefits
