12个职位: 招聘信息 执行官
Factory Manager (Johor)ID:60705
8,000 MYR ~ 12,000 MYRPontian工作内容
The RoleAs our Factory Manager, you will be the custodian of the end-to-end material lifecycle at our facility and the glue that brings our operations together. Moving beyond standard floor operations, you will take full ownership of the entire process—from the moment materials arrive at the factory, through physical processing and laboratory analysis, to final logistics. Just as importantly, you will be the unifying force that builds synergy across these diverse departments, ensuring that the team works as one cohesive unit to strictly meet all critical turnaround time targets.Key Responsibilities1. Factory & Processing Operations- Direct all daily factory operations, overseeing the intake, physical sorting, decanning, crushing, and milling of precious metal-bearing scrap materials.- Manage production schedules to ensure steady throughput, preventing bottlenecks on the factory floor and ensuring a continuous feed for subsequent stages.- Enforce strict inventory and material tracking controls to monitor mass balance and prevent any material loss during physical processing.2. Cross-Functional Coordination (Lab & Refining)- Work closely with the Laboratory team to ensure that milled and blended samples meet strict technical standards for grain size and homogeneity before assaying.- Coordinate seamlessly with the Refining team to streamline the hand-off of processed materials, aligning factory outputs with refining schedules and capacities.- Act as the primary operational link between material processing, laboratory feedback, and downstream refining execution to resolve any variance or workflow issues quickly.3. Maintenance, Logistics & Facility Management- Oversee warehouse logistics, incoming material reception, and the secure storage of high-value scrap and processed materials.- Supervise preventative maintenance programs for all heavy industrial machinery (e.g., shredders, ball mills, blending equipment) to ensure maximum equipment uptime.- Manage local operational budgets (OPEX) and factory floor resource allocation.4. Team Leadership & Regulatory Compliance- Lead, mentor, and build a disciplined factory workforce, including operators, supervisors, and warehouse staff, by setting clear operational KPIs.- Ensure the entire facility operates in strict compliance with Malaysia’s Department of Occupational Safety and Health (DOSH) standards and local municipal council regulations.- Coordinate closely with corporate functions to uphold company handbooks, workplace communication standards, and safety protocols on the floor.
福利制度
- Annual Leave 12 days
- Medical Leave
< 2 years : 14 days
2-5 years : 18 days
>5 years : 22 days
- Medical Claim up to RM 1500 yearly
- Performance Bonus
- Yearly IncrementAdvanced Package & Board Team (Senior/Staff/Principal)ID:59718
10,000 MYR ~ 30,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
The Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.Key Responsibilities1. Leadership & Strategy• Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.• Define and execute packaging and board technology strategy aligned with company silicon product roadmap.• Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).• Drive innovation in thermal management, signal integrity, and power delivery optimization.2. Technical Execution• Oversee design and validation of interposers, substrates, and system boards from concept to production release.• Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.• Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.• Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.• Manage board-level design for system bring-up, test platforms, and reference designs.3. Supplier & Ecosystem Management• Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.• Partner with EDA vendors to establish design automation flow and DRC verification.• Drive technology transfer and pilot runs with manufacturing partners.4. Project & People Management• Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.• Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.• Foster collaboration across silicon, test, reliability, and operations teams.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment