34个职位: 招聘信息 研发(工程师(半导体))
R&D EngineerID:59248
3,500 MYR ~ 7,000 MYRMalacca工作内容
As an R&D Engineer, you will play a key role in developing and improving advanced ceramic and electronic components. You will work closely with cross-functional teams across R&D, Quality, and Manufacturing to drive innovation, enhance product performance, and support new product development in line with customer and market demands.• Conduct research and development for new products, materials, and processes aligned with the company's core technologies.• Design experiments, analyze data, and document findings to validate new materials or processes.• Collaborate with HQ and global R&D teams to transfer technology and localize product development.• Support product design, prototyping, and testing phases to ensure manufacturability and performance.• Optimize existing processes to improve product quality, reduce cost, and enhance efficiency.• Prepare technical reports, documentation, and presentations for internal reviews or customer discussions.• Evaluate and qualify alternative raw materials, vendors, and process improvements.• Participate in customer technical meetings and provide engineering support for new product introductions (NPI).• Ensure all development activities comply with ISO standards, safety, and environmental regulations.
福利制度
Salary: ~RM3.5K - RM7K
AL: Starting from 8 days
SL: 14 / 18 / 22 days
<Other benefits>
• Performance bonus - depends on company and individual performance
• Medical coverage
• Personal insuranceFirmware EngineerID:59789
3,800 MYR ~ 6,800 MYRShah Alam工作内容
- Develop firmware programming for indoor and outdoor units of air-conditioner models using C Programming Language and Assembly Language. - Evaluate the developed firmware program through various stages of detailed testing, debugging, simulation and actual unit testing. - Build simple test circuits to evaluate the program through simulation. - Prepare documentation for the developed firmware programming. - Build Strong teamwork between inter-related R&D sections in developing air-conditioner models
福利制度
-Salary: RM3,800 - 6,800
- Annual Leave (15 days)
- Medical Leave (14 days)
- EPF & Sosco,
- Medical Insurance
- Group Term Life Insurance
- Free Parking
- Inhouse Cafeteria
- Inhouse Clinic
- Annual Increment
- Bonus (subject to company performance)Senior/Staff Digital Design EngineerID:59719
20,000 MYR ~ 25,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
This role will be responsible for architecting, designing, and verifying complex digital IPs and subsystems for SoCs or ASIC/FPGA-based products. As a senior role, it requires to work closely with system architects, verification, and physical design teams to deliver high-performance, power-efficient, and functionally correct RTL implementations. Overall, the responsibilities cover wider scope encompassing from IP to subsystem level and SOC level global issues.Key ResponsibilitiesArchitect with system engineers to perform:-• Define IP specifications, architecture & test concept.• Specify correct implementation of RTL design and verify digital circuits to deliver high performance, low power, and efficient implementation.• Conduct design reviews and support in documentation.• Support verification engineer to define verification test items.• Support in the roadmap formulation for the sensor IPs.• Support view generation engineers to verify the correctness of the Ips views.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSenior Staff Advanced Package & Board TeamID:59718
15,000 MYR ~ 30,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
The Senior Staff Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.Key Responsibilities1. Leadership & Strategy• Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.• Define and execute packaging and board technology strategy aligned with company silicon product roadmap.• Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).• Drive innovation in thermal management, signal integrity, and power delivery optimization.2. Technical Execution• Oversee design and validation of interposers, substrates, and system boards from concept to production release.• Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.• Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.• Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.• Manage board-level design for system bring-up, test platforms, and reference designs.3. Supplier & Ecosystem Management• Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.• Partner with EDA vendors to establish design automation flow and DRC verification.• Drive technology transfer and pilot runs with manufacturing partners.4. Project & People Management• Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.• Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.• Foster collaboration across silicon, test, reliability, and operations teams.
福利制度
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSr Standard Cell Design EngineerID:59656
10,000 MYR ~ 22,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking a Library Design Engineer to own the end-to-end development of a production-grade standard cell library on leading-edge process nodes. You will drive transistor-level design, multi-Vt cell topology, full characterization, and PPA validation delivering robust, sign-off-ready library views to downstream implementation flows. Seniority level to be determined by experience.Key Responsibilities• Design, simulate, and analyze standard cell circuits at transistor level, including combinational, sequential, clock, and physical utility cells across multiple Vt flavors (HVT/SVT/LVT/ULVT) and drive strengths.• Perform layout process-node-shift; guide layout clean-up effort and review for DRC/LVS compliance, EM/IR rules, and parasitic awareness at the cell level.• Define & execute characterization flow to generate complete library views & models, covering timing (NLDM/CCS/ECSM), power (dynamic, leakage, internal), noise, and variation-aware models (LVF/SOCV/POCV); ensure Liberty, LEF, and GDS consistency.• Define & execute QA regression to check library quality; validate cell robustness including noise margin, drive strength, X-propagation, and scan/DFT cell correctness; drive STA correlation using PrimeTime or Tempus to confirm model accuracy in real PD flows.• Lead standard cell library IP integration into Testchip, including Testchip circuit and test plan development; support hardware bring-up and debug.• Perform pre/post-silicon correlation & model/design optimization; drive root-cause analysis for first-silicon issues and implement yield/robustness improvements.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSr eFUSE Design EngineerID:59655
10,000 MYR ~ 22,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking an eFUSE Design Engineer to own the end-to-end development of production-grade eFUSE IP on leading-edge process nodes. You will drive eFUSE array architecture, circuit design, full simulation-based verification, collateral and view generation, and quality checks — delivering robust, sign-off-ready eFUSE IP to downstream SoC integration flows. Bitcell-level design knowledge is valued; direct bitcell design experience is a plus but not required. Seniority level to be determined by experience.Key Responsibilities• Design and architect the eFUSE array circuit, including sense amplifier, reference bias, programming current control, address decoder, column multiplexer, and repair logic; ensure correct functional operation across all PVT corners.• Develop and execute comprehensive simulation plans for the eFUSE macro, covering DC/AC characterization, programming/read margin analysis, retention, endurance, and reliability corner simulations (MC, Mismatch, Aging); validate against product specifications and foundry bitcell models.• Generate and validate all required IP deliverable views and collateral: timing models (Liberty .lib), physical abstracts (LEF/GDS), behavioral models (Verilog), datasheets, and application notes; ensure consistency across all views and compliance with delivery checklist.• Define and execute IP quality checks (QC) and quality assurance (QA) regression suites; run DRC/LVS/ERC/PEX sign-off on the eFUSE macro layout; conduct formal and simulation-based functional verification; ensure all sign-off criteria are met prior to IP release.• Collaborate with the foundry and PDK team on eFUSE bitcell characterization data, SPICE models, and process design rules; translate foundry bitcell specifications and reliability requirements into array-level design constraints.• Support Testchip integration of the eFUSE macro, including test circuit design, programming and read test plan development; assist in hardware bring-up, failure analysis, and silicon–to–simulation correlation.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSr Analog Circuit Design Engineer (Clocking)ID:59653
10,000 MYR ~ 22,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking a Circuit/Analog Design Engineer to develop high-performance analog/mixed-signal IPs from architecture through tapeout and silicon bring-up. The candidate should have specialized expertise in Clocking as described below. Seniority level to be determined by experience.Key Responsibilities• Design and debug PLL/DLL architectures and circuits (integer/fractional-N; analog or digital-assisted).• Oscillators: LC or ring-oscillator (RO) VCO/DCO, frequency synthesis, phase noise/jitter analysis and budgeting.• Delay lines, measurement/ruler circuitry, phase interpolators, and calibration/trim techniques.• DCC/DCM/DCA, clock tree/distribution, and clock management units; low-jitter clock generation and distribution networks.• Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization.• Behavioral modeling (e.g., Verilog-A/SystemVerilog) to explore loop dynamics, spur/jitter mitigation and system interactions.• Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics.• Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness.• Meet quality and reliability requirements (e.g., EM/IR, aging/overstress); contribute to robust design methodology and sign-off checklists.• Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSr Analog Circuit Design Engineer (High-Speed I/O)ID:59652
10,000 MYR ~ 22,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking a Circuit/Analog Design Engineer to develop high-performance analog/mixed-signal IPs from architecture through tapeout and silicon bring-up. The candidate should have specialized expertise in High-Speed I/O as described below. Seniority level to be determined by experience.Key Responsibilities• Design TX/RX, analog front-end, serializers/deserializers, high-speed level shifters, predrivers/drivers, and termination/impedance calibration blocks.• Equalization: Feed-Forward Equalization (FFE), DFE, CTLE and related adaptation/control loops.• Clocking support for links (e.g., CDR interactions, low-jitter clock generation/distribution as needed by PHY).• SI analysis and creation/validation of IBIS/IBIS-AMI models; channel characterization (insertion loss, return loss, crosstalk) and eye diagram margin assessment.• Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization.• Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics.• Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness.• Support interface integration and sign-off: PPA optimization, reliability checks (e.g., EM/IR, aging/overstress), and timing closure collaboration.• Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementSr Analog Circuit Design Engineer (Pure Analog)ID:59651
10,000 MYR ~ 22,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/Puchong工作内容
We are seeking a Circuit/Analog Design Engineer to develop high-performance analog/mixed-signal IPs from architecture through tapeout and silicon bring-up. Seniority level to be determined by experience.Key Responsibilities• Reference generation: bandgap, bias circuits, reference voltages/currents; high-accuracy, low-noise design techniques.• Low offset / low-noise voltage regulators (LDO) and stability/compensation networks; PSRR and transient response optimization.• Voltage and power monitoring circuits: droop detection, voltage detectors, PowerGood and POR generation, analog sensing, and housekeeping blocks.• Power-management components, linear and/or switching-adjacent blocks, charge pumps, as applicable to the SoC/PHY environment.• Design/support ADC/DAC blocks and associated analog support circuits (sampling, references, amplifiers/comparators, clocking).• Voltage and temperature sensor design and characterization. Bandgap and PTAT-based temperature sensing; process corner detection circuits. Sensor readout, digitization, and calibration techniques.• Own end-to-end block/IP delivery: architecture studies, specification, transistor-level design, simulation, post-layout sign-off, and silicon bring-up/characterization.• Build verification test benches; validate performance across PVT corners, mismatch/Monte Carlo (as applicable), and post-extraction parasitics.• Work closely with layout/mask designers: floorplanning guidance, layout reviews, and ensuring LVS/DRC clean implementation and parasitic awareness.• Meet quality and reliability requirements (e.g., EM/IR, aging/overstress); contribute to robust design methodology and sign-off checklists.• Support IP integration on to Testchip as well as post-silicon evaluation including correlation with simulation and root-cause analysis for first-silicon bring-up.
福利制度
- Annual Leave 14 days
- Medical Leave 14 days
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly IncrementTool Maker (Stamping)ID:59553
3,000 MYR ~ 4,500 MYRBukit Minyak工作内容
- Maintaining stamping dies in good productive condition.- Analyze problem and repair tooling for corrective action.- Make improvement and propose corrective and preventive action.- Understand and read engineering drawing.- Setup and follow-up on die setup and minor trouble-shooting on press machine.- Assemble new tooling and modification / upgrading.- Operate surface grinding machine for fabrication, resurface and modification.- Completes routine die report for traceability / improvements and communicates effectively through detail information.- Control spare part inventory.- Conduct test runs with completed tools or dies to ensure that parts meet specifications; make adjustments as necessary.- File, grind, shim, and adjust different parts to properly fit them together.- Fit and assemble parts to make, repair, or modify dies, jigs, gauges, and tools, using machine tools and hand tools.- Inspect finished dies for smoothness, contour conformity, and defects.- Lift, position, and secure machined parts on surface plates or worktables, using hoists, vises, v-blocks, or angle plates.- Set up and operate conventional or computer numerically controlled machine tools such as lathes, milling machines, and grinders to cut, bore, grind, or otherwise shape parts to prescribed dimensions and finishes.- Smooth and polish flat and contoured surfaces of parts or tools, using scrapers, abrasive stones, files, emery cloths, or power grinders.- Verify dimensions, alignments, and clearances of finished parts for conformance to specifications, using measuring instruments such as calipers, gauge blocks, micrometers, and dial indicators.- To handle other tasks and duties as and when requested by superior.
福利制度
- AL: 12 days, increase gradually based on company policy.
- Individual Insurance
- Medical RM200/year & Dental RM300/year
- Toll claimable (Candidate from Island only)
- Mobile allowances (Depend)
- Individual bonus - 1month fixed
- Increment every year (July) -Rate based on performance
