Staff Process EngineerID:60850

13,000 MYR ~ 15,000 MYR霹雳 Perak约5小时 ago

概述

  • 薪资

    13,000 MYR ~ 15,000 MYR

  • 工作行业

    -

  • 工作内容

    Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

    【Key Responsibilities】
    - Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
    - Ramp up manufacturing volume and qualify required sources.
    - Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
    - Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
    - Manage Product Lifecycle Management documents to the latest status.
    - Conduct change-management with suppliers to sustain / improve capacity and cost.
    - Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
    - Serve as the key manufacturing engineering interface for NPI-to-production transfers.
    - Manage OSAT and contract manufacturing relationships supporting production.

资格

  • 任职资格

    【Must】
    - Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
    - having at least 8 years Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
    - Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
    - Knowledge of wire bonding.
    - Knowledge of SPC and statistical analysis software (such as JMP).

    【Advantage】
    - Cu Clip, Thin Die, Power QFN
    - Package development knowledge
    - Experience transitioning products from Development to Production
    - Experience supporting NPI to Mass Production

  • 英文

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  • 其他语言

    English

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