Reeracoen Malaysia helps you search for Engineer(Electrical/Semi-Conductor) job vacancy in Malaysia. Our professional consultants help you find the right job. Looking for Job in Malaysia, Think of Reeracoen Malaysia.

+60-32020-1885

Time:9:00-18:00(Mon-Fri)

List of Engineer(Electrical/Semi-Conductor) job vacancies in Malaysia

Conditions in searching
All50 (1〜20 )

-New Product Introduction- NPI Product Engineer (Junior) ID:40846

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 3 years of semiconductor assembly NPI experience.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.
7) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

-New Product Introduction- NPI Process Engineer (Senior) ID:40845

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : More than 5 years related working experience in Semiconductor
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 30 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location Banting (Selangor)

-New Product Introduction- NPI Process Engineer (Junior) ID:40844

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : At least 3 - 5 years related working experience in Semiconductor
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

Field Service Engineer ID:40893

Job Description Company Profile / Introduction:
A Japanese manufacturing company which establish in Malaysia in year 1994. They manufacturing of automotive parts, car emblems, home appliances, game accessories parts and so on. All of their products are developed and assembled in-house. Therefore they are reliable and of high quality.

Location: Port Klang (30 minutes driving distance to Bandar Bukit Tinggi)

Job Responsibilities:
-Dealing with Semiconductor foreign manufacturer
-Business trips to Penang, Johor & etc
-Preferable Japanese speaker as need to contact with HQ
Required Qualifications Requirements:
- Well-versed in English
- Possess at least Diploma and above
- At least 3 years related experience (Semiconductor Equipment)
- Aged from 28-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 2,500MYR 〜 5,000MYR
Location Subang Jaya (Selangor)

Field Service Engineer- Japanese Speaker ID:40890

Job Description Company Introduction: This company is doing the trading of semiconductor manufacturing equipment, specialized in cutting, dicing, grinding and polishing. Established in 1937, and currently having 4000 over employees. They are also pay attention to their own company structure and environment. Right now focusing on both Operation and Organization Management in order to achieve the vision of doing well in human resource management and high customer satisfaction.

Location: Subang Jaya (USJ 2)
- 7 minutes driving distance to Sunway Pyramid.
- Quick access to different highways and other Selangor regions.

Job Responsibilities:
-Dealing with Semiconductor foreign manufacturer
-Business trips to Penang, Johor & etc
-Preferable Japanese speaker as need to contact with HQ
Required Qualifications Requirements:
- Well-versed in English,Japanese
- Possess at least Diploma and above
- Fresh Graduate or related experience
- Aged from 28-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 2,500MYR 〜 5,000MYR
Location Subang Jaya (Selangor)

Industrial Engineering (IE) Engineer (Senior) ID:40850

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- To manage asset condition of asset transfer between factories
- Annual plan for volume and target productivity indices
- To analyze and report productivity indices to Top management
- To plan and implement layout analysis
- Assist in investment planning (to improve frequency effectiveness)
- Factory base planning
- Factory automation implementation
- Costing & profitability analysis
- Improve manpower automation
- Maximize efficiency on machine / space usage
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree in Industrial Engineering or Science or similar disciplines
- Experience :
1) Minimal 5 years of experience
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Articulate, result oriented
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Age : 30 - 40
- Others :
1) Willing to learn, passion for growth
2) Can work independently

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location Banting (Selangor)

R&D Package Developer (Senior) ID:40855

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location Banting (Selangor)

R&D Package Developer (Junior) ID:40854

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) Minimal 2-years working experience in semiconductor R&D experience is preferred.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

R&D Package Developer (Manager) ID:40856

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Certificate :
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location Banting (Selangor)

R&D Process Developer (Junior) ID:40857

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) Minimal 2-years working experience in semiconductor R&D experience is preferred.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 26 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

R&D Process Developer (Manager) ID:40859

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location Banting (Selangor)

R&D Process Developer (Senior) ID:40858

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location Banting (Selangor)

Industrial Engineering (IE) Engineer (Junior) ID:40848

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- To manage asset condition of asset transfer between factories
- Annual plan for volume and target productivity indices
- To analyze and report productivity indices to Top management
- To plan and implement layout analysis
- Assist in investment planning (to improve frequency effectiveness)
- Factory base planning
- Factory automation implementation
- Costing & profitability analysis
- Improve manpower automation
- Maximize efficiency on machine / space usage
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree in Industrial Engineering or Science or similar disciplines
- Experience :
1) Minimal 1-2 years of experience with or without similar industry.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Articulate, result oriented
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 26 - 40
- Others :
1) Willing to learn, passion for growth
2) Can work independently

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

-New Product Introduction- NPI Product Engineer (Senior) ID:40847

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 5 years of semiconductor assembly NPI experience.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 30 - 40
- Gender : Open
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.
7) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location Banting (Selangor)

【経験者歓迎】設計エンジニア(電気電子) ID:39917

Job Description ★求人の魅力→成長産業、産業機械のお仕事です!日本人が住みたい国連続10年ナンバーワンの国、マレーシアを拠点にグローバルな活躍をしてみませんか?

【企業概要】
FA機器の電気制御回路/プログラム/ PLCラダー図の設計
プロジェクトの計画と実装
機械の試験と設置
取扱説明書の作成。
主なお取引先は、デンソー、エプソン、パナソニック、ソニーなど。

【職務内容】
FA機械の詳細部品図面およびアセンブリ図面
プロジェクトの計画および実装
機械のテストおよび設置
指示書の作成
必要に応じて顧客サイトへの訪問のためのエンジニアリングチームおよびプロジェクトの管理
主なお取引先は、デンソー、エプソン、パナソニック、ソニーなど

【勤務エリア】Shah Alam
(シャー・アラム)クアラ・ルンプール近郊にあり、スルタン・サラディン・アブドゥル・アジズ・モスク、通称ブルー・モスクで有名な街です。
工業都市として発展し、工業エリア内に製造工場を持つ会社が、国産、外資系を問わず多数存在しています。
Required Qualifications 言語 : 日本語、英語 コミュニケーションレベル
学歴 : 大卒以上、関連分野
経験 : 5年以上の電気電子設計経験。FA業界経験必須
Salary Monthly Salary 5,000MYR 〜 10,000MYR
Location Shah Alam (Selangor)

Semiconductor Sales Engineer [KL Office] (Japanese Speaker) ID:40012

Job Description Company Introduction:
One of the Top Semiconductor manufacturer (Originated from Japan), established in 1954. Southeast Asia HQ is in Singapore with warehouse. On top of that, they also doing sales and marketing of semiconductor for all appliances such as Automobile, TV, air conditioner etc. Main clients are SONY, Panasonic, HOSHIDEN, ALPS, HITACHI.

Location:
Sales office in Malaysia: KL & Penang.
Nearby to Amcorp Mall, easy access to Lebuhraya Persekutuan.

Job Scopes:
Report to Japanese MD
<Objective>
- Support Customers technical requirement
- Support sales staff
- Updating new technologies and products information

<Duties & Tasks>
[Investigation]
- Customers information: Technical requirement, Demand, Price, Information, Quality condition, computer information etc.
- Market Information by all kinds of source.
- Update own products and technology information.

[Making Good relationship with internal and external social community]

[Providing Information and awareness]
- Create technology and products awareness to customers.
- Feedback information to customers as soon as possible.
- Share technology and products information to all sales staffs.
- Report information to Immediate Superior and Sales Staff.

[Promotion]
- Promote aggressively to customers.
- Update promotion status from time to time with Sales staff.

[Supporting]
- Technology meeting between customers and designers.
- Technical seminar etc.
- Checking condition of Sample
Required Qualifications Requirements:
-Well-versed in English, Chinese AND Japanese (JLPT N2 and above)
-Possess advanced Diploma / Bachelor's Degree in Engineering related
- 1 to 2 years of working experience as sales engineer (experience in semiconductor distribution field will be priority
- 25 to 55
- Others : Possess good communication skills with high level of commitment and independent

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 4,000MYR 〜 5,500MYR
Location Petaling Jaya (Selangor)

Head of CD Mechanism Department ID:40150

Job Description - Report to Factory Engineering General Manager
- Manage CD-Mechanism department
- Initiate and lead to achieve KPI set by top management
- Identify and spot any of the opportunity for the existing process improvement activities and cost saving program
- Supervise and lead engineer and technician
- Provide guidance, mentoring and training to engineer and technician
- Involve in CDM Line, customer warranty and CAR plant reject analysis and preventive action
- Perform any other job function that may be assigned from time to time from immediate superior
Required Qualifications - Language : English
- Education Background : Degree in any Engineering, prefer Electrical/Electronic or mechanical
- Experience :
> 15 years experience in related field
> Preferable with experience in CD-Mechanism, or at least in car audio mechanism
> Experience in New Model Launch, or NPI (New Products Introduction)
- Require skills : Understanding of TS16949
- Certificate : N/A
- Age : 38 ~ 45
- Others :
> Hands on experience and effective people management, with individual and department KPI
> Communication capability between native American and Japanese
Salary Monthly Salary 8,000MYR 〜 9,000MYR
Location Penang

PLC Maintenance Engineer ID:40800

Job Description Company Introduction:
Establish in 1960, One of the Japanese 's industry leader in PVC and semiconductor silicone products. They have been supplies and develop many kinds of products to leading corporate company in consumer electronics, automotive, electronic components, semi conductor and others. Their mission is by using company's products materials compound and processing technologies to supply high quality of products to market according consumer's demand.

Location: HICOM, Shah Alam.

Job Responsibilities:
-Responsible for overall machines & facilities maintenance, ie.
-Troubleshooting, preventive maintenance, corrective maintenance especially mechanical, electrical and electronic maintenance of all machines and processing lines to ensure no down time.
-To ensure that all machines are operating at optimum condition.
-To continuously improve and upgrading machines to improve product quality, to achieve higher machine efficiency and machine performance, safety, reliability and cleanliness.
-Perform Schedule maintenance.
-Sustain machine in good condition and the up time of the equipment meeting the operational goals of uptime, cost and yield.
-Committed to the task assigned.
Improve each equipments minor stoppage.
-To establish and implement preventive maintenance and calibration of equipment.
-To ensure maintenance cost are Within the budget.
-Cost effective management of maintenance parts usage.
-To maintain good cleanliness and safety in production and Workshop
-To maintain the facility and equipment of the Whole office & factory and ensuring in good condition
Required Qualifications Requirements:
-Well versed in English,Chinese,Malay
-Posses at least Degree or Diploma in Mechatronics
-Posses at least 2 years relevant working experience.
-Require Skill : Knowledge of Mitsubishi PLC, Pneumatic system,is an advantage.
-Others : Enterprising, mature, independent and able to communicate with people of different level multi-culture.
-Prefer Male Candidate's Age from 22-40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 4,000MYR 〜 6,000MYR
Location Shah Alam (Selangor)

-Manufacturing- Customer Service Executive ID:40799

Job Description Company Introduction:
Establish in 1960, One of the Japanese 's industry leader in PVC and semiconductor silicone products. They have been supplies and develop many kinds of products to leading corporate company in consumer electronics, automotive, electronic components, semi conductor and others. Their mission is by using company's products materials compound and processing technologies to supply high quality of products to market according consumer's demand.

Location: HICOM, Shah Alam.

Job Responsibilities:
-Familiar with customers' requirements and competent in processing Customers Orders
-Build and maintain good rapport with customers to understand their requirements, obtain feedback on service performances and response to enquiries and service issues highlighted by the customers.
-Work with the operations team to provide feedback to customer on operations issues, resolve service issues highlighted by the customers and ensure that customers performance measurements are met.
-Updating of customers' inventory report
-Preparing of KPI statistics and reports for customers and internal use.
-Responsible for individual administration functional role
-Must have the initiative and proactive towards inquiries and follow ups.



Required Qualifications Requirements:
-Well Versed in English & Japanese
-Posses at least Degree in any field
-At least 3 years working experience and knowledge in Customers Service Environment
- Require Skill : Have knowledge in Technical background

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 4,000MYR 〜 6,000MYR
Location Shah Alam (Selangor)

Production Executive(Japanese speaker) ID:40797

Job Description Company Introduction:
Establish in 1960, One of the Japanese 's industry leader in PVC and semiconductor silicone products. They have been supplies and develop many kinds of products to leading corporate company in consumer electronics, automotive, electronic components, semi conductor and others. Their mission is by using company's products materials compound and processing technologies to supply high quality of products to market according consumer's demand.

Location: HICOM, Shah Alam.

Job Responsibilities:
- To manage a team of production Workers
- To coordinate daily production inputs (materials) & outputs (finished products) - To plan production schedules to meet delivery requirements
- To plan for manpower & capacity utilization to meet production targets
- To coordinate with purchasing & sales departments for production planning
- To monitor product quality & resolve daily production issues
- To ensure production processes comply with ISO Standard
- To handle current or future projects for company development
Required Qualifications -Well versed in English & Japanese
-Posses at least Degree in Mechanical (preferably Japanese university)
-At least 3 years of experiences in related field
-Require Skill : JLPT N2
-Prefer Male candidate's age from 22-40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 4,000MYR 〜 6,000MYR
Location Shah Alam (Selangor)

All50 (1〜20 )