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List of Engineer(Electrical/Semi-Conductor) job vacancies in Malaysia

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All41 (1〜20 )

Sales Executive (Mandarin Speaker) ID:43156

Job Description Company Profile: Japan manufacturer of Copper foil for Printed Circuit Boards and Resin coated copper foil (established in 1985, Malaysia) with the recognition of ISO 14001 since 2005. High Quality Assurance and Environment program, ensure that only high quality copper foil products are being supplied to the customers. MCF is able to achieve this with the support of an effective management system and stringent process controls and inspections. Also, equipped with state-of-the-art analysis equipment with highly skill resources to provide First Class technical support to our customers.

Job Scopes:
- To liaise with customers or affiliated companies on matters related to product quality, cost & delivery
- To coordinate with internal Departments such as Production, Shipping and Quality Control to fulfill customers’ requirements.
- To maintain good business relationship with customers
- To conduct market research, collect market information and keep updated with the latest market developments.
- Familiar with international business eg export procedures and documentation.
Required Qualifications Requirements:
- Good command in English and Mandarin
- Posses Bachelor Degree Chemical Engineering, Electronics Engineering, Material Science, Chemistry/Physics. Candidates with Degree in Business/Marketing must have working experience in manufacturing selling technical products. Technical savvy to discuss with customers’ engineers.
- Min 4 years working experience in Corporate Sales in manufacturing environment, which has international /export market business is an added advantage.
- Others:
* Drinking Alcohol (mid to high alcohol tolerance)
* Will be required to travel for biz trips to China, Taiwan and other countries at company's discretion.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 4,500MYR 〜 5,500MYR
Location

Sales & Marketing Manager (Kuala Lumpur – Petaling Jaya) ID:43150

Job Description Company Profile: A Japanese trading and manufacturer company of industrial equipment / tools. It is a one-stop provider for the industrial needs from Factory Automation, especially for Press Die and Plastic Mold. It was newly established in Malaysia in 2010, HQ in Japan. Other than that, they have having branches in Singapore, Phillipines, New Zealand, Australia and Middle East regions. A large and strong foundation corporation, holding the philosophy to serve the customers with good quality products, lower costs and short period of delivery.

Job Scopes:
- Responsible to the achievement of overall sales targets and performance of the sales team
- Building up and implementing the sales strategy for Malaysia market
- Analysing and providing timely and accurate sales reports by quantitative and qualitatively to management
Required Qualifications Requirements:
- Good command in English & Chinese
- Diploma / Degree in Mechanical Engineering
- At least 5 years Manager experience in sales in a managerial role / 10 years + of experience in the factory automation / Machine builder / Electrical / automotive industry
- Has proven track record in achievement of sales targets and manage the sales team
- Possess own transport
- Travelling within Malaysia is required

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more information.
Salary Monthly Salary 6,800MYR 〜 9,000MYR
Location

Electrical Design Engineer ID:42688

Job Description Company Profile: Japanese Machinery Manufacturer, established in 1972 (Japan) and 1995 (Malaysia). Total of 130 employees in the organization (Malaysia). Their core business is manufacturing machines related to Factory Automation, Semi-conductor and Office equipment. Specialized in Die Bonder, Die Sorter, Handler, Substrate processing, LCD, IC card and more equipment.

Job Responsibilities:
- To do simple edit programming, compile and create executing file accordingly.
- Install the executing file to machine and doing some simple debugging.
- To feedback / design simple program together with the supervisor or with the support from supervisor.
- To handle chip, lead frame, PCB recognition test and conclude an advice with the guidance from supervisor.
- To add certain function to existing program with the guidance from supervisor.
- To design / feedback similar software from one machine to another.
- To design software for the middle scale by referring to other sample such as changing of loader type & adding of polygon area search.
Required Qualifications Requirements:
- Good command in Chinese, English and Malay
- Degree in Electrical/Electronics/Control Engineering
- Fresh graduate only
- Knowledge in vision system and motion control
- Knowledge in C Language, C++ Language programming
- Knowledge in hardware actuator (motor, driver, sensor) and AutoCAD software for drafting and design
- Possess own transport and willing to travel outstation
[Advantage]
- Able to communicate in Japanese
- Knowledge in vision system and motion control
- Knowledge in C Language, C++ Language programming
- Knowledge in hardware actuator (motor, driver, sensor) and AutoCAD software for drafting and design
- Strong interest in machinery, automation system and hardware configuration

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 2,500MYR 〜 2,700MYR
Location

Mechanical Design Engineer ID:42415

Job Description Company background:
Japanese Machinery Manufacturer, established in 1972 (Japan) and 1995 (Malaysia). Total of 130 employees in the organization (Malaysia). Their core business is manufacturing machines related to Factory Automation, Semi-conductor and Office equipment. Specialized in Die Bonder, Die Sorter, Handler, Substrate processing, LCD, IC card and more equipment.


Working Location: Subang (Selangor)

Job scope:
- To do simple edit programming, compile and create executing file accordingly.
- Install the executing file to machine and doing some simple debugging.
- To feedback / design simple program together with the supervisor or with the support from supervisor.
- To handle chip, lead frame, PCB recognition test and conclude an advice with the guidance from supervisor.
- To add certain function to existing program with the guidance from supervisor.
- To design / feedback similar software from one machine to another.
- To design software for the middle scale by referring to other sample such as changing of loader type & adding of polygon area search.
Required Qualifications Requirements:
-Able to communicate via Chinese English and Malay
-Graduate from Degree in Mechanical Engineering
-Experience: Fresh graduate only.
- CGPA 3.0 and above.
- Able to communicate in Mandarin or Japanese Language (Added advantage).
- Knowledge in vision system and motion control.
- Knowledge in C Language, C++ Language programming.
- Knowledge in hardware actuator (motor, driver, sensor) and AutoCAD software for drafting and design.
- Strong interest in machinery, automation system and hardware configuration.
Others:Possess own transport and willing to travel outstation.



Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 2,700MYR 〜 2,700MYR
Location

-Die Bonder / Wire Bonder Machinery- Service Engineer (Malacca) ID:41437

Job Description Company Profile: A Japanese company, providing the machinery under the division of various cutting edge technologies, expertise for 50 years in the relevant industry. Their innovative products are die bonder, wire bonder, flip chip bonder, bund bonder and more that support the operation of semiconductor production line. Servicing most of the semiconductor manufacturer as their products are constantly advancing as demands for smart functions and higher performance improvement.

Location: Malacca

Job Scopes:
- Responsible for Installation, service and maintenance for our products
- Clients are Semi conductor company
- Many outstation jobs in all Malaysia, about 4 - 5 days per week
- Company has meeting on Monday (Malacca)
- Few outstation to Thailand and other country
- Report to Malaysian Leader
Required Qualifications Requirements:
- Well-versed in English, Malay,Chinese
- Graduated as Degree in Mechanical or Electrical
- More than 3 years of related experience or maintenance experience of Semiconductor machine (Must)
- Driving own car
- Aged from 25 - 30 (Male)

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 2,000MYR 〜 3,500MYR
Location

Production Assistant Manager ID:40289

Job Description - Report to Director, Managing Director
- Assisting Production Manager to oversee the production department
- Plan and lead a production team to achieve production output and quality standards
- Responsible for daily production operations with a view to increase productivity and optimize resources available
- Develop production capacity plan and oversee its execution to meet delivery requirements
- Manage efforts to standardize work and set target cycle time for every product and process
- Oversee day to day production activities including production planning, part receiving, manpower planning, lots sequencing, process monitoring, and delivery
- Review processes and make recommendations for improvement and evaluate effectiveness
- Implement continuous improvement plans in terms of quality and productivity
- Enforce safety and health policy, procedures and guidelines
- Continually upgrade competencies of executives and supervisors
Required Qualifications - Language : English, Malay
- Education Background : Diploma / Degree holder in any Engineering discipline
- Experience :
> Experience in Automotive industry about 2 years
> Advantage for those who have knowledge and experience in wire harness
- Skill : Familiar with ISO 14001 and TS16946
- Certificate : N/A
- Age : 30 ~ 45
- Others : Candidate must be willing to work in Jitra area
Salary Monthly Salary 3,000MYR 〜 3,800MYR
Location

【経験者】メーカーでのセールスサポートエンジニア募集!! ID:42545

Job Description 【メーカー、工場で使われるありとあらゆるモノをお届けする会社。】
今までは、シンガポールでマレーシア拠点も管轄していたが、マレーシアの伸びが顕著のため、今後の業務拡大、利益拡大のため、マレーシア単体でMDを置き注力することにした。
現在のお客様は、既に4000社。そのうち1200社程度がアクティブ。
(内訳:マレーシアローカル企業70%以上・日本企業20%程度)
自社でも製品を製造しているが、マレーシアでも今後は他社ブランドも取り扱いをし、
商社としても売り上げを拡大する予定。

<<仕事内容>>
セールスチームと共に製品の技術的な問い合わせに対応いただくのが業務になります。 基本はオフィス勤務で、外訪営業からの問い合わせに応えるのが大半ですが、必要に応じ、外訪営業とお客様に同行する場合もあります。
・セールスチームに対する技術的なアシスト
・顧客に対するテクニカルサポート
・競合他社製品の研究、市場トレンドの調査
・レポート作成 等
Required Qualifications <<応募資格>>
必須条件:
・半導体・電機部品等の製造装置設計経験者
Salary Monthly Salary 7,000MYR 〜 10,000MYR
Location

Technical & Service Support Executive (Audio / Home Appliances) ID:42717

Job Description Company Profile: A well-known music education & instruments trading company which founded at the year of 1887. They are actively promoting music-related activities such as music festivals, competitions, and having own music school in order to render the arts of music to the society.

Job Scopes:
- Responsible to troubleshoot, service and/or repair Commercial Audio products and/or Products assigned.
- To support and complement the Sales and Marketing strategies and activities for Commercial Audio products in Malaysia.
- To attend to all indoor and outdoor servicing and repair of the Products assigned
- To provide technical support in the system integration of the products for Commercial Audio sales & marketing activities
- To complement and support Commercial Audio sales & marketing activities
- To administer job scope and submit timely reporting
- To participate in company's event and projects
Required Qualifications Requirements:
- Good command in Chinese, English and Malay
- Minimum Diploma or Degree in Audio Engineer, E&E Engineer or other related field.
- Experience in audio technician or electronic Engineer.
- Experience in repairing electronic of home appliances.
- Electronics repair - component level

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 2,000MYR 〜 3,500MYR
Location

R&D Process Developer (Manager) ID:40859

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location

R&D Package Developer (Manager) ID:40856

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Certificate :
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location

R&D Package Developer (Senior) ID:40855

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location

R&D Process Developer (Senior) ID:40858

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location

-Electrical & Electronics Components Manufacturer- QA Executive ID:41165

Job Description Company Profile: This Japanese company specializing in manufacturing component products for Electrical and Electronic's companies was established in Malaysia (first branch in Shah Alam) since July 1987 with an initial workforce of 30 person. Currently, they have three branch in Malaysia located at Selangor, Penang and also Johor.

Location: Located about 14 mins' drive from Starhill Golf & Country Club via Jalan Dato Onn Utama.

Job Descriptions:
- Process Establishment, Maintenance and Control
- Setting agreed clear requirement with customer through quality plan
- Ensures compliance of customer requirements, industry standard and safety at work place
- Primary interface with customers on quality related matter
- Participate and support regulatory and customer audits at site
- Build and Embed Quality Awareness in Operations
- Provide Technical Guidance & Communications to Engineers/Technicians
- Any other relevant duties/responsibilities to be assigned from time to time
Required Qualifications Requirements:
- Well versed in English
- Posses at least Degree or Diploma in any fields
- Att least 5 years experience in QA electronic or electronic parts
- Knowledge of ISO9001:2015 and ISO14001:2015, can negotiate skill for QA with cliant
- Prefer candidates age from 25-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 2,300MYR 〜 2,500MYR
Location

PLC Mechanical and Electrical Engineer - Japanese Speaker (Production maintenance) ID:41743

Job Description Company Profile: This company is established in 1948 as the leading company, specializing in the manufacture of quartz crystal devices. These products have vast array of applications that are the essential ones in electronic equipment. Also, applying its crystal technologies to sensors and a full spectrum of new high-value-added components and products that sustained business growth as a comprehensive manufacturer of frequency control devices.

Location: Kawasan Perindustrian Hicom (Petaling Jaya)

Job Scopes:
* Understand of predictive, preventive, corrective maintenance
* Understand and able to make schedule for maintenance system
* Able to make improvement when necessary include action plan, schedule, etc
* Able to communicate and good manner in communication to all level of people include japanese
* Able to control of technician,etc
* Able to communicate with machine supplier/maker when necessary
* Able to use AutoCAD/PLC is an added advantage fast action is needed when required
* Able to understand of machine circuit diagram/etc
* Able to identify and know of machine sparepart (electronic/mechanical)
* Understanding of production condition and together for improvement
Required Qualifications Requirements:
- Good command in English, Japanese
- Graduated with at least Diploma/Degree in Electrical/Mechanical/Mechatronic Engineering
- At least 1 year working experience involve PLC
- Knowledge in Visual Basic
- Aged from 23-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 2,500MYR 〜 4,000MYR
Location

【経験者歓迎】設計エンジニア(電気電子) ID:39917

Job Description ★求人の魅力→成長産業、産業機械のお仕事です!日本人が住みたい国連続10年ナンバーワンの国、マレーシアを拠点にグローバルな活躍をしてみませんか?

【企業概要】
FA機器の電気制御回路/プログラム/ PLCラダー図の設計
プロジェクトの計画と実装
機械の試験と設置
取扱説明書の作成。
主なお取引先は、デンソー、エプソン、パナソニック、ソニーなど。

【職務内容】
FA機械の詳細部品図面およびアセンブリ図面
プロジェクトの計画および実装
機械のテストおよび設置
指示書の作成
必要に応じて顧客サイトへの訪問のためのエンジニアリングチームおよびプロジェクトの管理
主なお取引先は、デンソー、エプソン、パナソニック、ソニーなど

【勤務エリア】Shah Alam
(シャー・アラム)クアラ・ルンプール近郊にあり、スルタン・サラディン・アブドゥル・アジズ・モスク、通称ブルー・モスクで有名な街です。
工業都市として発展し、工業エリア内に製造工場を持つ会社が、国産、外資系を問わず多数存在しています。
Required Qualifications 言語 : 日本語、英語 コミュニケーションレベル
学歴 : 大卒以上、関連分野
経験 : 5年以上の電気電子設計経験。FA業界経験必須
Salary Monthly Salary 5,000MYR 〜 10,000MYR
Location

-New Product Introduction- NPI Product Engineer (Junior) ID:40846

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,(If Japanese speaker, advantage)
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 3 years of semiconductor assembly NPI experience or from Machine vendor company.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.
6) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location

-New Product Introduction- NPI Product Engineer (Senior) ID:40847

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 5 years of semiconductor(power discrete) assembly NPI experience.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 30 - 40
- Gender : Open
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.
6) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location

R&D Process Developer (Junior) ID:40857

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) Minimal 2-years working experience in semiconductor, R&D experience.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 26 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location

-New Product Introduction- NPI Process Engineer (Junior) ID:40844

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : At least 3 - 5 years related working experience in Semiconductor or from Machine vendor company.
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location

-New Product Introduction- NPI Process Engineer (Senior) ID:40845

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : More than 5 years related working experience in Semiconductor(power discrete) or Machine vendor company
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 30 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location

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