Application Engineer (Melaka)ID:61348

3,000 MYR ~ 4,500 MYR马六甲 Malacca2日 ago

概述

  • 薪资

    3,000 MYR ~ 4,500 MYR

  • 工作行业

    Manufacturing(Electronics/Semiconductors)

  • 工作内容

    Process development
    - Driving end-to-end process development and continuous improvement across internal teams
    - Support customer process development and optimize application performance

    Test Cut
    - Conduct in-house application test cuts to obtain best combination of dicing blades and parameters
    - Provide on-site customer technical support to resolve customer issues (e.g. Quality, MTBA and etc)

    Affiliate offices coordination / communication
    - Communicate regularly with engineering teams across regions to coordinate technical alignment and solutions

    Customer Relations
    - Establish and maintain strong customer relationships to ensure satisfaction and increase reputation
    - Advanced technologies
    - Responsible to keep up-to-date on latest technologies for dicing, grinding, and polishing
    - Understand and utilize to meet customers’ need

资格

  • 任职资格

    Education:
    - Degree in Electrical & Electronic Engineering, Materials Engineering , Mechanical Engineering , Physics or equivalent

    Experience:
    - Min 1-2 years experience in any semiconductor manufacturing environment, or experience with DISCO dicing machines
    - Entry level candidates or fresh graduates are welcome to apply

    - Self-driven and strong motivated team player with keen technical ability, systematic approach, detailedoriented, excellent problem-solving skills, and positive attitude
    - Possesses good English communication and writing capability. Knowing Japanese language is an extra advantage
    - Able to use Microsoft Excel and PowerPoint
    - Able to perform under pressure and tight timelines
    - Meticulous with strong analytical and trouble shooting skill

  • 英文

    -

  • 其他语言

    Mandarin, English

附加信息

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