概要

• 給与

  25,000 MYR ~ 40,000 MYR

• 業界

  Software/Information Processing, IT/Telecommunications, Manufacturing(Computer/Telecommunication), Manufacturing(Electronics/Semiconductors)

• 仕事内容

  The Director of Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.
  
  The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.
  
  Key Responsibilities
  1. Leadership & Strategy
  • Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.
  • Define and execute packaging and board technology strategy aligned with company silicon product roadmap.
  • Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).
  • Drive innovation in thermal management, signal integrity, and power delivery optimization.
  
  2. Technical Execution
  • Oversee design and validation of interposers, substrates, and system boards from concept to production release.
  • Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.
  • Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.
  • Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.
  • Manage board-level design for system bring-up, test platforms, and reference designs.
  
  3. Supplier & Ecosystem Management
  • Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.
  • Partner with EDA vendors to establish design automation flow and DRC verification.
  • Drive technology transfer and pilot runs with manufacturing partners.
  
  4. Project & People Management
  • Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.
  • Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.
  • Foster collaboration across silicon, test, reliability, and operations teams.