概述

• 薪资

  2,000 MYR ~ 4,000 MYR

• 产业类别

  Manufacturing(Machinery)

• 工作内容

  Company Profile: A Japanese company, providing the machinery under the division of various cutting edge technologies, expertise for 50 years in the relevant industry. Their innovative products are die bonder, wire bonder, flip chip bonder, bund bonder and more that support the operation of semiconductor production line. Servicing most of the semiconductor manufacturer as their products are constantly advancing as demands for smart functions and higher performance improvement.
  
  Job Scopes:
  - Responsible for Installation, service and maintenance for our products
  - Clients are Semi conductor company
  - Many outstation jobs in all Malaysia, about 4 - 5 days per week
  - Company has meeting on Monday (Malacca)
  - Few outstation to Thailand and other country
  - Report to Malaysian Leader