概要
給与
4,500 MYR ~ 7,000 MYR
業界
Manufacturing(Electronics/Semiconductors)
仕事内容
- Provide technical support to customers, troubleshoot and resolve issues, and deliver effective solutions for the application of bonding wire products.
- Interact with customers to understand their technical requirements, analyzing and resolving product performance issues, and supporting the implementation of bonding wire solutions at customer sites.
- Collaboration with internal stakeholders to enhance product development and ensure customer satisfaction is also a key aspect of the role.
- To plan and conduct technical project independently for product improvement and product engineering functional study.
- Responsible for the supervision/guidance/training of department Engineers & Technician level staff.
- Coordinate and leading engineers for wire bonding evaluation activities and projects.
- Prepare technical data related to company products.
- Undertake any other duties that maybe assigned by superior or person acting on behalf of the company.
求めている人材
応募条件
- Education Background: At least Bachelor Degree of Engineering in Materials, Electronics, Mechanical or other related technical field.
- Experience: Minimum 3 years' experience in Wire Bonding field
Required skills:
- Analytical and problem solving skills, effective,
- Communication in English.
- Problem-solving skills
- Japanese language is an advantage英語
-
その他言語
Malay, English
その他
福利厚生
- AL: Starting from 10 days
- MC: Starting from 14 days
- Position allowance RM200
- Rental house allowance RM100
- Meal allowance (RM3 per working day)
- Transport allowance based on mileage
- Toll expenses claimable for mainland cdd
- OT claimable
- Company events
- Medical claimable: RM1000, family RM250
- Dental: RM250
- Yearly Increment
- Japanese Language allowance就業時間
8.30am ~ 5.30pm
休日
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職種
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