Staff Process EngineerID:60851

13,000 MYR ~ 15,000 MYRシャーアラム Shah Alam約6時間 前

概要

  • 給与

    13,000 MYR ~ 15,000 MYR

  • 業界

    -

  • 仕事内容

    Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

    【Key Responsibilities】
    - Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
    - Ramp up manufacturing volume and qualify required sources.
    - Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
    - Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
    - Manage Product Lifecycle Management documents to the latest status.
    - Conduct change-management with suppliers to sustain / improve capacity and cost.
    - Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
    - Serve as the key manufacturing engineering interface for NPI-to-production transfers
    - Manage OSAT and contract manufacturing relationships supporting production

求めている人材

  • 応募条件

    【Must】
    - Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
    - having at least 8 years Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
    - Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
    - Knowledge of wire bonding.
    - Knowledge of SPC and statistical analysis software (such as JMP).

    【Advantage】
    - Cu Clip, Thin Die, Power QFN
    - Package development knowledge
    - Experience transitioning products from Development to Production
    - Experience supporting NPI to Mass Production

  • 英語

    -

  • その他言語

    English

その他