Staff Process EngineerID:60154

9,983 MYR ~ 14,267 MYRバヤン・レパス Bayan Lepas約9時間 前

概要

  • 給与

    9,983 MYR ~ 14,267 MYR

  • 業界

    Manufacturing(Electronics/Semiconductors)

  • 仕事内容

    【Job description】
    Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

    【Key Responsibilities】
    - Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
    - Ramp up manufacturing volume and qualify required sources.
    - Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
    - Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
    - Manage Product Lifecycle Management documents to the latest status.
    - Conduct change-management with suppliers to sustain / improve capacity and cost.

求めている人材

  • 応募条件

    【Must】
    - Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
    - Having at least 5 years experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
    - Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
    - Knowledge of SPC and statistical analysis software (such as JMP).

  • 英語

    -

  • その他言語

    English

その他

  • 福利厚生

    Annual Salary Range :RM119800-RM171200
    (Monthly: RM9,983-RM14,267)

    *Regarding the employee benefits, please check them directly with the company during your interview.

  • 就業時間

    - ~ -

  • 休日

    Follow Malaysian Calendar

  • 職種