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List of Manufacturing(Electronics/Semiconductors) job vacancies in Malaysia

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All48 (1〜20 )

Sales Executive (Mandarin Speaker) ID:43156

Job Description Company Profile: Japan manufacturer of Copper foil for Printed Circuit Boards and Resin coated copper foil (established in 1985, Malaysia) with the recognition of ISO 14001 since 2005. High Quality Assurance and Environment program, ensure that only high quality copper foil products are being supplied to the customers. MCF is able to achieve this with the support of an effective management system and stringent process controls and inspections. Also, equipped with state-of-the-art analysis equipment with highly skill resources to provide First Class technical support to our customers.

Job Scopes:
- To liaise with customers or affiliated companies on matters related to product quality, cost & delivery
- To coordinate with internal Departments such as Production, Shipping and Quality Control to fulfill customers’ requirements.
- To maintain good business relationship with customers
- To conduct market research, collect market information and keep updated with the latest market developments.
- Familiar with international business eg export procedures and documentation.
Required Qualifications Requirements:
- Good command in English and Mandarin
- Posses Bachelor Degree Chemical Engineering, Electronics Engineering, Material Science, Chemistry/Physics. Candidates with Degree in Business/Marketing must have working experience in manufacturing selling technical products. Technical savvy to discuss with customers’ engineers.
- Min 4 years working experience in Corporate Sales in manufacturing environment, which has international /export market business is an added advantage.
- Others:
* Drinking Alcohol (mid to high alcohol tolerance)
* Will be required to travel for biz trips to China, Taiwan and other countries at company's discretion.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 4,500MYR 〜 5,500MYR
Location

【業界経験者募集】超老舗/日系メーカーで営業職【マレーシアからタイへのキャリア!】 ID:43202

Job Description 当社は、商社機能をもつ日系メーカーです。
設立から約60年の歴史を持つ老舗企業ですが、日本国内にとどまらず、海外でも積極的に事業展開をしてきました。

この長年の経験で培われた技術力により、他社に負けないコスト・品質力を持っています。
マレーシアでは特に、エアコン部品を主に製造・販売しています。

【このお仕事の魅力】
1)しっかりとした研修体制!
 取り扱い製品がわからないから心配という方にも大丈夫。
 1年間はマレーシアの製造現場でしっかりと商材について学んでいただけます。

2)東南アジアを担当できる!
 マレーシアでの研修後は、タイ拠点にて営業を行っていただきます。
 一つの拠点にとどまるだけではなく、東南アジアをまたにかけてお仕事していただきます。

ご応募、お待ちしております!
Required Qualifications 【必須】製造会社の働く経験

英語力:英語での面接ができるレベルの英語力必須
学歴:専門卒以上(ビザ申請の為)

Salary Monthly Salary 7,000MYR 〜 10,000MYR
Location

-Semiconductor Manufacturer- Senior/Field Application Engineer (FAE) ID:41133

Job Description Company Profile: Provides services and high-value products, including semiconductor components, electronic devices, network equipment and software, primarily to Japanese and foreign electrical and electronics manufacturers who lead the information and telecommunication industry. The company also respects the autonomy of employees, and assigns sufficient authority to younger managers, achieving the decision-making speed required by business. This approach will be maintained consistently, in pursuit of technologies and services unique, helping customers increase their own value.

Location: Subang Jaya (SS15), this is a sales office. This area is a city center, having entertainment , convenience stores, restaurants and shopping malls nearby.

Job Scopes:
* Drive design in and product promotional activities in Malaysia
* Spearhead development of new demand creation accounts
* Align and coordinate with suppliers for all technical promotions activities
* Excellent troubleshooting skills to provide in-depth technical support to customers
* Conduct seminars and training to customers
* Review and follow-up customer technical requests, propose solution to ensure customer satisfication.
* Build and maintain good relationship with both customers and suppliers
Required Qualifications Requirements:
- Proficient in English,
- Possessed a Diploma or Degree in Electronics & Electrical Engineering, with good knowledge and application experience on analog & power management circuit design
- Minimum 2 years relevant working experiences in electronic industry
- Overseas travel maybe required

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 4,000MYR 〜 8,000MYR
Location

Senior Accounting Executive ID:42495

Job Description - Report to Managing Director (Tomizawa-San)
- Communicate with Japane HQ in any accounting issue
- Handle daily accounting functions
- Prepare monthly accounts schedules and bank reconciliations
- Assist in year end audit and prepare audit schedules
- Manage full set of accounts to ensure compliance of accounting policies and procedures
- Handle GST preparations
- Scanning and filling of documents/vouchers
- Perform ad hoc duties from time to time
Required Qualifications - 3 ~ 5 years of full set accounting experience
Salary Monthly Salary 2,000MYR 〜 3,000MYR
Location

Production Assistant Manager ID:40289

Job Description - Report to Director, Managing Director
- Assisting Production Manager to oversee the production department
- Plan and lead a production team to achieve production output and quality standards
- Responsible for daily production operations with a view to increase productivity and optimize resources available
- Develop production capacity plan and oversee its execution to meet delivery requirements
- Manage efforts to standardize work and set target cycle time for every product and process
- Oversee day to day production activities including production planning, part receiving, manpower planning, lots sequencing, process monitoring, and delivery
- Review processes and make recommendations for improvement and evaluate effectiveness
- Implement continuous improvement plans in terms of quality and productivity
- Enforce safety and health policy, procedures and guidelines
- Continually upgrade competencies of executives and supervisors
Required Qualifications - Language : English, Malay
- Education Background : Diploma / Degree holder in any Engineering discipline
- Experience :
> Experience in Automotive industry about 2 years
> Advantage for those who have knowledge and experience in wire harness
- Skill : Familiar with ISO 14001 and TS16946
- Certificate : N/A
- Age : 30 ~ 45
- Others : Candidate must be willing to work in Jitra area
Salary Monthly Salary 3,000MYR 〜 3,800MYR
Location

Human Resource Manager ID:40046

Job Description - Report to Director, Managing Director
- Responsible for full spectrum of Human Resource Operation functions including development and implementation of HR policies, Operation, Procedures and Programs, Recruitment Activities, Compensation & Benefit, Payroll, Training and Development, Cost Management and Manpower Planning, Employee's relations/ disciplinary matters, Security, Employee Welfare and others HR related duties.
- To administer payroll activities which includes overtime, allowances, Medical, EPF & Socso.
- Maintain all personnel information in an accurate and up-to-date manner in line with the company policy and legislative requirements.
- Communicate HR policies and procedures in accordance with legal and company guidelines.
- To become the windows person and company representative dealing with goverment authority (Kementerian Dalam Negeri and etc.)
- Modifying and amending existing SOP from time to time to cope with the current needs.
- Responsible for creating / maintaining healthy work environment
Required Qualifications - Language : English, Malay
- Education Background : Diploma / Degree holder in Human Resource study
- Skill :
> Understanding of full spectrum of Human Resource Operation
> Preferable candidate with basic understanding of ISO 14000, ISO 16000 and safety
- Experience :
> Over 10 years of experience in Human Resource, among those with over 3 years of managerial level experience
> Preferable candidate with working experience in Japan company
- Certificate : N/A
- Age : 35 ~ 45
- Others :
> Good communication skill, this position must be able to communicate with multi-level staffs from director to operators
> Not a solo performer, must be a team player
Salary Monthly Salary 3,500MYR 〜 6,000MYR
Location

やる気重視!/ 総務職 【ペナンエリア勤務】 ID:41339

Job Description 1941年創業の歴史ある日系メーカーが総務職のポジションを募集しています。半導体製造用部材やHDD用ガラスディスクから、メガネレンズ、コンタクトレンズ、さらには医療用内視鏡などの医療分野へと事業を広げられている最先端の企業で働いてみませんか?ペナン。ゆったりした環境で暮らしたい方にぴったり!福利厚生も充実しており、ペナンには10名の日本人がいらっしゃるため、不明点や心配事を気軽に聞くことができる環境です。

総務関係等全般をお任せいたします。
-ビザ、社宅、車管理等含めた全般的な赴任者のフォロー
-マレーシア法人の業務が円滑にまわるための日本との橋渡し役
-ビジター対応(出張者、社外のお客様のお世話含ます。ホテル・タクシー手配もして頂きます)
-MDやダイレクターなど社内エグゼクティブのフォロー業務
-赴任者・出張者・Visitorが交通事故を起こした場合など、
緊急で対応が必要な事象が発生した場合は休日、就業時間後も勤務発生します。
-その他庶務全般
※ご経験に応じて、ご希望であれば購買業務等もお願いするかもしれません。
ペナンには10名の日本人がいらっしゃるため、不明点や心配事を気軽に聞くことができる環境です。
Required Qualifications ■必須スキル
経験:社会人経験3年以上~(VISAが降りないため)
スキル:運転可能、通勤可能な方
□尚可スキル
秘書、総務経験よりも、性格重視です。
細やかな性格でホスピタリティ豊富な方を望みます。
なんでもやりますという姿勢を基本に持っている方を望みます。
Salary Monthly Salary 5,000MYR 〜 7,000MYR
Location

R&D Process Developer (Manager) ID:40859

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location

R&D Package Developer (Manager) ID:40856

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Certificate :
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location

R&D Package Developer (Senior) ID:40855

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location

R&D Process Developer (Senior) ID:40858

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location

-Electrical & Electronics Components Manufacturer- QA Executive ID:41165

Job Description Company Profile: This Japanese company specializing in manufacturing component products for Electrical and Electronic's companies was established in Malaysia (first branch in Shah Alam) since July 1987 with an initial workforce of 30 person. Currently, they have three branch in Malaysia located at Selangor, Penang and also Johor.

Location: Located about 14 mins' drive from Starhill Golf & Country Club via Jalan Dato Onn Utama.

Job Descriptions:
- Process Establishment, Maintenance and Control
- Setting agreed clear requirement with customer through quality plan
- Ensures compliance of customer requirements, industry standard and safety at work place
- Primary interface with customers on quality related matter
- Participate and support regulatory and customer audits at site
- Build and Embed Quality Awareness in Operations
- Provide Technical Guidance & Communications to Engineers/Technicians
- Any other relevant duties/responsibilities to be assigned from time to time
Required Qualifications Requirements:
- Well versed in English
- Posses at least Degree or Diploma in any fields
- Att least 5 years experience in QA electronic or electronic parts
- Knowledge of ISO9001:2015 and ISO14001:2015, can negotiate skill for QA with cliant
- Prefer candidates age from 25-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 2,300MYR 〜 2,500MYR
Location

- Semiconductor Equipment - Sales Executive (Japanese Speaker) ID:41399

Job Description Company Profile: Pioneer in energy, a broad sector that encompasses LPG , portable gas stoves, industrial gases such as hydrogen, and other segments. Over the years, however, the company has extended its operations into other businesses, including machinery, welding, electronic equipment, materials, and food.

Location: Golden Triangle (Kuala Lumpur City Center)

Job Scopes:
- Sales of Semiconductor manufacturing equipment, and related parts
- Clients are Semiconductor manufacturing company
- Sales is whole Malaysia so need to go business trip (not so many)
- Sales executive need to drive your own car own business
- Report to team Leader or Japanese General Manager
Required Qualifications Remuneration packages:
- Proficient in Chinese, Japanese (N3 or above) and English
- Graduated in any field more than Degree
- Fresh graduate is available to apply
- About 1-2 years Sales experience in any industry
- Aged from 21- 33

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 3,000MYR 〜 5,500MYR
Location

PLC Mechanical and Electrical Engineer - Japanese Speaker (Production maintenance) ID:41743

Job Description Company Profile: This company is established in 1948 as the leading company, specializing in the manufacture of quartz crystal devices. These products have vast array of applications that are the essential ones in electronic equipment. Also, applying its crystal technologies to sensors and a full spectrum of new high-value-added components and products that sustained business growth as a comprehensive manufacturer of frequency control devices.

Location: Kawasan Perindustrian Hicom (Petaling Jaya)

Job Scopes:
* Understand of predictive, preventive, corrective maintenance
* Understand and able to make schedule for maintenance system
* Able to make improvement when necessary include action plan, schedule, etc
* Able to communicate and good manner in communication to all level of people include japanese
* Able to control of technician,etc
* Able to communicate with machine supplier/maker when necessary
* Able to use AutoCAD/PLC is an added advantage fast action is needed when required
* Able to understand of machine circuit diagram/etc
* Able to identify and know of machine sparepart (electronic/mechanical)
* Understanding of production condition and together for improvement
Required Qualifications Requirements:
- Good command in English, Japanese
- Graduated with at least Diploma/Degree in Electrical/Mechanical/Mechatronic Engineering
- At least 1 year working experience involve PLC
- Knowledge in Visual Basic
- Aged from 23-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information.
Salary Monthly Salary 2,500MYR 〜 4,000MYR
Location

-New Product Introduction- NPI Product Engineer (Junior) ID:40846

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,(If Japanese speaker, advantage)
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 3 years of semiconductor assembly NPI experience or from Machine vendor company.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.
6) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location

-New Product Introduction- NPI Product Engineer (Senior) ID:40847

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 5 years of semiconductor(power discrete) assembly NPI experience.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 30 - 40
- Gender : Open
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.
6) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location

R&D Process Developer (Junior) ID:40857

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) Minimal 2-years working experience in semiconductor, R&D experience.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 26 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location

-New Product Introduction- NPI Process Engineer (Junior) ID:40844

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : At least 3 - 5 years related working experience in Semiconductor or from Machine vendor company.
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location

-New Product Introduction- NPI Process Engineer (Senior) ID:40845

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : More than 5 years related working experience in Semiconductor(power discrete) or Machine vendor company
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 30 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
5) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location

-Manufacturing- Planning & Customer Service Officer (Junior) [Japanese Speaker] ID:40851

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Responsible as a window person to communicate with overseas customers
- Maintain good rapport with customers and constantly improve customer relation
- To coordinate meeting between customers and internal departments to support customer request matter
- To review and understand all the contract terms and requirement
- To handle ad-hoc and special project as required by customer
- Follow up the shipment status and operation flow for customer
- Answer to customer inquiries / complaints
Required Qualifications Requirements:
- Well-versed in English & Japanese
- Graduated in Degree in Engineering or relevant
- Experience :
1) 1-5 years working experience in customer service.
- Require Skill :
1) Good verbal communication skills especially English and Japanese language.
2) Knowledge in Japanese language is added advantage
- Certificate :
- Age : 25 - 40
- Others :
1) Good analytical thinking

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 2,770MYR 〜 5,000MYR
Location

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