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List of Manufacturing(Electronics/Semiconductors) job vacancies in Malaysia

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All67 (1〜20 )

高給与、厚待遇!食堂付き(60円程度でランチが食べられる)通訳募集!(日・英) ID:40820

Job Description 経験により最大RM10,000(日本円約250000円ほど)まで給与支給可能!マレーシア国内の給与だとかなりの高額です★メーカー工場にてローカルスタッフと日本人スタッフとの間で社内通訳をご担当いただきます。報告書などの文書翻訳もお任せします。工場のあらゆる部門でご活躍いただくため、工場やメーカー企業での通訳経験をお持ちの方が望ましいです。

Required Qualifications ■必須スキル
英語:翻訳可能レベル
学歴:不問
経験:下記のいずれかに該当する方
① 製造業での通訳としての経験
② 通訳としての経験

その他:社会人経験5年以上の方のみ

Salary Monthly Salary 5,000MYR 〜 10,000MYR
Location Other Country

Sales Executive ID:39535

Job Description - Maintaining and developing relationships with existing customers
- Acting as a WINDOW for customer and contact between group of companies
- Negotiating variations in price, delivery and specifications with customer
- To find new customers & to do market research
- Gaining a clear understanding of customers‘ businesses and requirements
Required Qualifications Language: English
Education Background: High School Graduate or Diploma holder in Business Administration
Experience:
-1-2 years sales working experience and prior experience in HDD industry would be an added advantage
Require skills: Possess presentation skills, interpersonal communications and negotiation skills
Certificate: N/A
Age: 22 - 35
Gender: Male
Others:
-Willing to learn, positive attitude & having enthusiasm to work
-Posses own transport
Salary Monthly Salary 2,200MYR 〜 4,000MYR
Location Subang Jaya (Selangor)

-New Product Introduction- NPI Product Engineer (Junior) ID:40846

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 3 years of semiconductor assembly NPI experience.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.
7) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

-New Product Introduction- NPI Process Engineer (Senior) ID:40845

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : More than 5 years related working experience in Semiconductor
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 30 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location Banting (Selangor)

-New Product Introduction- NPI Process Engineer (Junior) ID:40844

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
- Experience : At least 3 - 5 years related working experience in Semiconductor
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate : Knowledge and experience with JEDEC/JEITA standards, ISO & TS16949 qualifications is desirable
- Age : 26 - 40
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

Field Service Engineer ID:40893

Job Description Company Profile / Introduction:
A Japanese manufacturing company which establish in Malaysia in year 1994. They manufacturing of automotive parts, car emblems, home appliances, game accessories parts and so on. All of their products are developed and assembled in-house. Therefore they are reliable and of high quality.

Location: Port Klang (30 minutes driving distance to Bandar Bukit Tinggi)

Job Responsibilities:
-Dealing with Semiconductor foreign manufacturer
-Business trips to Penang, Johor & etc
-Preferable Japanese speaker as need to contact with HQ
Required Qualifications Requirements:
- Well-versed in English
- Possess at least Diploma and above
- At least 3 years related experience (Semiconductor Equipment)
- Aged from 28-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 2,500MYR 〜 5,000MYR
Location Subang Jaya (Selangor)

Field Service Engineer- Japanese Speaker ID:40890

Job Description Company Introduction: This company is doing the trading of semiconductor manufacturing equipment, specialized in cutting, dicing, grinding and polishing. Established in 1937, and currently having 4000 over employees. They are also pay attention to their own company structure and environment. Right now focusing on both Operation and Organization Management in order to achieve the vision of doing well in human resource management and high customer satisfaction.

Location: Subang Jaya (USJ 2)
- 7 minutes driving distance to Sunway Pyramid.
- Quick access to different highways and other Selangor regions.

Job Responsibilities:
-Dealing with Semiconductor foreign manufacturer
-Business trips to Penang, Johor & etc
-Preferable Japanese speaker as need to contact with HQ
Required Qualifications Requirements:
- Well-versed in English,Japanese
- Possess at least Diploma and above
- Fresh Graduate or related experience
- Aged from 28-35

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-20201885 for more info.
Salary Monthly Salary 2,500MYR 〜 5,000MYR
Location Subang Jaya (Selangor)

Industrial Engineering (IE) Engineer (Senior) ID:40850

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- To manage asset condition of asset transfer between factories
- Annual plan for volume and target productivity indices
- To analyze and report productivity indices to Top management
- To plan and implement layout analysis
- Assist in investment planning (to improve frequency effectiveness)
- Factory base planning
- Factory automation implementation
- Costing & profitability analysis
- Improve manpower automation
- Maximize efficiency on machine / space usage
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree in Industrial Engineering or Science or similar disciplines
- Experience :
1) Minimal 5 years of experience
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Articulate, result oriented
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Age : 30 - 40
- Others :
1) Willing to learn, passion for growth
2) Can work independently

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location Banting (Selangor)

Procurement Officer (Junior) ID:40852

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Source multiple vendors that can supply equivalent quality and fulfilling required specifications with best price.
- Actively involved in price negotiations and cost reduction activities towards achieving periodical target set.
- Plan supply orders and ensure timely supply delivery to ensure production operation is not affected.
- Manage and continuously improve inventory control and ensuring inventory is at optimum level
- Manage vendor management including in conflict mineral reporting, ICP, PTA, vendor certification status and vendor audits.
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Degree in any Engineering or equivalent qualifitcations
- Experience :
1) Minimal 1-2years working experience in procurement, handling overall vendor management,
- Require Skill :
1) Good verbal communication skills in writing and speaking
2) Good negotiation skills and follow up
3) Analytical and good with numbers
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 4,500MYR 〜 5,000MYR
Location Banting (Selangor)

R&D Package Developer (Senior) ID:40855

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location Banting (Selangor)

R&D Package Developer (Junior) ID:40854

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) Minimal 2-years working experience in semiconductor R&D experience is preferred.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 25 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

R&D Package Developer (Manager) ID:40856

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Package research and (Mechanical/Electrical) characterization
- Package Leadframe and Clip Design and design rule development
- Package outline design and design rule development
- Package development based on APQP
- Project management for package development
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Certificate :
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location Banting (Selangor)

R&D Process Developer (Junior) ID:40857

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) Minimal 2-years working experience in semiconductor R&D experience is preferred.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 26 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

R&D Process Developer (Manager) ID:40859

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 8-years working experience in semiconductor R&D experience will be considered for management post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 6,000MYR 〜 8,000MYR
Location Banting (Selangor)

R&D Process Developer (Senior) ID:40858

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Semiconductor discrete package design and development
- Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages
- Characterize and qualify new process technologies for power discrete product manufacturing.
- Project management for process and material development
- Process/material development based on APQP
- Process and material development documentation
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Master of Bachelor Degree in Electronics/Mechanical/Mechatronics Engineering, Physics, Material Science or similar experiences
- Experience :
1) More than 5-years working experience in semiconductor R&D experience will be considered for senior post.
- Require Skill :
1) Hands-on knowledge and experience in semiconductor manufacturing processes, such as dicing, die attach, clip bond, molding process, and singulation.
2) In-depth knowledge in power MOSFET and diode packages like SO8-FL, SOD and PQFN
3) Advanced knowledge in wafer stress relief, laser dicing, solder paste die attach, cu-clip bonding, IR reflow, plasma cleaning.
4) Hands-on knowledge and experience in project management for research and development projects
5) Proven track record to bring a product from conceptual stage to high volume manufacturing stage
6) Skill and knowledge in AutoCAD, Multiphysics simulation, Analytical methodology (DOE etc) are preferred.
7) Good written and verbal communication skills
8) Able to present ideas, design concepts, data and plan with high confidence.
9) Able to perform work independently as well as in team.
- Age : 30 - 40

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information

Salary Monthly Salary 4,500MYR 〜 7,000MYR
Location Banting (Selangor)

Industrial Engineering (IE) Engineer (Junior) ID:40848

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- To manage asset condition of asset transfer between factories
- Annual plan for volume and target productivity indices
- To analyze and report productivity indices to Top management
- To plan and implement layout analysis
- Assist in investment planning (to improve frequency effectiveness)
- Factory base planning
- Factory automation implementation
- Costing & profitability analysis
- Improve manpower automation
- Maximize efficiency on machine / space usage
Required Qualifications Requirements:
- Well-versed in English,
- Graduated in Degree in Industrial Engineering or Science or similar disciplines
- Experience :
1) Minimal 1-2 years of experience with or without similar industry.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Articulate, result oriented
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 26 - 40
- Others :
1) Willing to learn, passion for growth
2) Can work independently

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,000MYR 〜 5,000MYR
Location Banting (Selangor)

-New Product Introduction- NPI Product Engineer (Senior) ID:40847

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- New product introduction (NPI), setup and qualification of new process/new machines
- Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
- Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities
Required Qualifications Requirements:
- Well-versed in English
- Graduated in
1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
- Experience :
1) Minimal 5 years of semiconductor assembly NPI experience.
2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
- Require Skill :
1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
- Certificate :
- Age : 30 - 40
- Gender : Open
- Others :
1) Mandarin Speaker (Added Advantage),
2) Japanese Speaker (Added Advantage),
3) Preferably non-Malays to join if possible
4) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
5) Proven track record to bring a process from qualification/prototype stage to HVM stage.
6) Able to perform independent qualification approval test and planning work with minimal supervision.
7) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 5,000MYR 〜 6,000MYR
Location Banting (Selangor)

-Manufacturing- Planning & Customer Service Officer (Junior) [Japanese Speaker] ID:40851

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Responsible as a window person to communicate with overseas customers
- Maintain good rapport with customers and constantly improve customer relation
- To coordinate meeting between customers and internal departments to support customer request matter
- To review and understand all the contract terms and requirement
- To handle ad-hoc and special project as required by customer
- Follow up the shipment status and operation flow for customer
- Answer to customer inquiries / complaints
Required Qualifications Requirements:
- Well-versed in English & Japanese
- Graduated in Degree in Engineering or relevant
- Experience :
1) Minimal 1-2years working experience in customer service.
- Require Skill :
1) Good verbal communication skills especially English and Japanese language.
2) Knowledge in Japanese language is added advantage
- Certificate :
- Age : 25 - 40
- Others :
1) Good analytical thinking

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 4,000MYR 〜 5,000MYR
Location Banting (Selangor)

Junior Software Developer (Manufacturing Execution System-MES) ID:40861

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Assist development manager in creating technological roadmap for Manufacturing Execution System (MES)
- Design and enhance MES system to meet business requirement by following SDLC methodology
- Writing high quality code to complete the program development on schedule
- Perform code review
- Review user requirements and prepare specification documents for custom development
- Provide user support on operational problem/queries and troubleshoot application issues
- Identify opportunities for improvement and make constructive suggestion to change
- Undertake any other tasks / projects as required
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Bachelor Degree in computer science or recognized university
- Experience :
1) Minimum 3-years programming experience in core skills and in technology consulting industry or software industry
2) Experienced in leading a group of software developers
3) Experienced in VB6, ASP
- Require Skill :
1) Strong problem solving and analytics skills
2) Hands-on experience in VB.NET, T-SQL, ASP.NET, jQuery
- Age : 25 - 40
- Others :
1) Committed to work and able to perform under pressure
2) Continually build knowledge and skills to improve oneself
3) Able to work independently with minimal guidance

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,500MYR 〜 6,000MYR
Location Banting (Selangor)

Junior Software Engineer (Manufacturing Execution System-MES) ID:40863

Job Description Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

Job Responsibilities:
- Support roll out and use of automation system in production and design solutions to simplify equipment integration and MES
- Support the use of MES in production and enhance the MES as assigned
- Participate in the requirement gathering session and provide technical expertise to team members and users
- Writing high-quality code to complete the program development on schedule
- Collaborating with development team and other IT staff to prepare solutions for new applications
- Create system documentation and user guide
- Provide user support on operational problem/queries and troubleshoot application issues
- Perform code review on programs written by other IT staff
- Identify opportunities for improvement and make constructive suggestion to change
- Undertake any other tasks/projects as required
Required Qualifications Requirements:
- Well-versed in English
- Graduated in Bachelor Degree in computer science or recognized university
- Experience :
1) Minimum 3-years programming experience in core skills and working experience in equipment management in manufacturing industry
- Require Skill :
1) Hands-on experience in Microsoft C# or Java programming
2) Hands-on experience in one of the scripting languages such as Perl or Python
3) Hands-on experience in PC/communication hardware troubleshooting is an added advantage
4) Strong problem solving and analytics skills
- Age : 25 - 40
- Others :
1) Committed to work and able to perform under pressure
2) Continually build knowledge and skills to improve oneself
3) Able to work independently with minimal guidance
4) Familiar with SECS/GEM
5) Familiar with mechanical or electronics product automation

Contact:
1. Send in your latest resume to info-my@reeracoen.asia
2. Call in +603-2020 1885 for more information
Salary Monthly Salary 3,500MYR 〜 6,000MYR
Location Banting (Selangor)

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