-New Product Introduction- NPI Product Engineer (Junior)ID:40846

3,000 MYR ~ 5,000 MYRBantingOver 3 months ago

Overview

  • Salary

    3,000 MYR ~ 5,000 MYR

  • Industry

    Manufacturing(Electronics/Semiconductors)

  • Job Description

    Company Profile: One of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Serve Power Discrete semiconductor companies with quick turn, high quality packaging and test services. More than 40 years of power discrete experience, features 260k sq. ft. of manufacturing floor space and is Japanese Automotive Certified (HVM) that aims to supply their products to Asia, America and Europe. In addition, Malaysia manufacturer is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001 and SONY Green Partner industry standards to provide with consistently reliable, robust and high quality products.

    Location: Quick access to Jalan Klang Banting, surrounded with towns and living areas.

    Job Responsibilities:
    - New product introduction (NPI), setup and qualification of new process/new machines
    - Working with cross functional departments to run sample builds (ES/Qual/CS) on specific processes
    - Represent company to liaise and provide relevant process and material information to external parties on various new business opportunities

Qualifications

  • Requirement

    Requirements:
    - Well-versed in English,(If Japanese speaker, advantage)
    - Graduated in
    1) Degree/Master in electronics and or manufacturing engineering, materials engineering or similar disciplines
    2) Knowledge and experience with Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive is desirable.
    - Experience :
    1) Minimal 3 years of semiconductor assembly NPI experience or from Machine vendor company.
    2) Experience in working with R&D Engineers and providing input on Design for Manufacture, Assembly and Test at semiconductor packaging
    - Require Skill :
    1) Excellent project management, organizational and interpersonal skills in relation to NPI engineering tasks.
    2) Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.
    - Certificate :
    - Age : 26 - 40
    - Others :
    1) Mandarin Speaker (Added Advantage),
    2) Japanese Speaker (Added Advantage),
    3) Hands-on knowledge in single or multi manufacturing processes, such as dicing, die attach, clip bond, reflow, wire bond, molding as well as EOL process.
    4) Proven track record to bring a process from qualification/prototype stage to HVM stage.
    5) Able to perform independent qualification approval test and planning work with minimal supervision.
    6) In-depth knowledge in TO-220, SOP8 flat lead for power MOSFET and diode packages.

    Contact:
    1. Send in your latest resume to info-my@reeracoen.asia
    2. Call in +603-2020 1885 for more information

  • English Level

    -

  • Other Language

    English

Additional Information